Driven by the need to reduce the power consumption of mobile devices, and servers/data
centers, and yet continue to deliver improved performance and experience by the end …

Chiplet-based designs enable the heterogeneous integration of die from multiple process
nodes into a single packaged product. High-bandwidth memory is a well-known high …

This book provides a sound grasp of the fundamental concepts, applications, and practice of
EMC. Developments in recent years have resulted in further increases in electrical …

Three-dimensional (3D) integration of electronic chips has been advocated by both industry
and academia for many years. It is acknowledged as one of the most promising approaches …

The push to meet growing user requirements and manufacturing challenges at lower
technology nodes have motivated chip designers to adopt non-traditional design …

Physical limit of transistor miniaturization has driven chip design into the third dimension. 3D
integration technology emerges as a viable option to improve chip performance and …

For stacked integrated circuits, effective test access requires the design-for-test (DfT)
features in the various dies to operate in a concerted way to transport test stimuli and …

This second part addresses a selection of topics related to Electromagnetic interference
(EMI) issues in three-dimensional integrated components. Details about Through Silicon Via …

The success of chiplet-based design critically depends on standards, especially those for
die-to-die interconnects. Universal Chiplet Interconnect Express (UCIe) is such a standard …

Through-Silicon-Via (TSV)-based three-dimensional ICs (3D-ICs) have gained increasing
attention due to their potential in reducing manufacturing costs and capability of integrating …