Three-dimensional (3-D) hyperintegration is an emerging technology, which vertically stacks
and interconnects multiple materials, technologies, and functional components to form …

Three-dimensional integrated circuits (3-D ICs) offer significant improvements over two-
dimensional circuits, and promise a solution to the severe problems that are being, and will …

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …

Ultra-thin chip technology has potential to provide solutions for overcoming bottlenecks in
silicon technology and for leading to new applications. This, however, requires new …

Three dimensional integrated circuits (3D ICs) can alleviate the problem of interconnection,
a critical problem in the nanoscale era, and are also promising for heterogeneous …

Ultra-thin chip technology has potential to provide solutions for overcoming bottlenecks in
silicon technology and for leading to new applications. This, however, requires new …

Three dimensional integrated circuits (3D ICs) can alleviate the problem of interconnection,
a critical problem in the nanoscale era, and are also promising for heterogeneous …

In 3-D integrated circuits (3-D ICs), through silicon via (TSV) is a critical technique to provide
vertical connections. However, the yield and reliability challenge of TSV in industry is one of …

Three-dimensional integrated circuits can significantly mitigate the challenges posed by
shrinking feature sizes and enable heterogeneous integration. This paper focuses on the 3D …

In 3-D integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in
providing vertical connections. However, the yield is one of the key obstacles to adopt the …