Exploring sub-20nm FinFET design with predictive technology models

S Sinha, G Yeric, V Chandra, B Cline… - Proceedings of the 49th …, 2012 - dl.acm.org
Predictive MOSFET models are critical for early stage design-technology co-optimization
and circuit design research. In this work, Predictive Technology Model files for sub-20nm …

Two-Dimensional Pattern Formation Using Graphoepitaxy of PS-b-PMMA Block Copolymers for Advanced FinFET Device and Circuit Fabrication

H Tsai, JW Pitera, H Miyazoe, S Bangsaruntip… - ACS …, 2014 - ACS Publications
Directed self-assembly (DSA) of lamellar phase block-co-polymers (BCPs) can be used to
form nanoscale line-space patterns. However, exploiting the potential of this process for …

Method of making a FinFET device

JCY Yin, CH Wu, KC Ting, KH Chen - US Patent 8,697,515, 2014 - Google Patents
BACKGROUND The semiconductor integrated circuit (IC) industry has experienced
exponential growth. Technological advances in IC materials and design have produced …

Comparative study of novel u-shaped SOI FinFET against multiple-fin bulk/SOI FinFET

M Son, J Sung, HW Baac, C Shin - IEEE Access, 2023 - ieeexplore.ieee.org
Superior scalability and better gate-to-channel capacitive coupling can be achieved with
adopting gate-all-around (GAA) device architecture. However, compared against FinFET …

GIDL in doped and undoped FinFET devices for low-leakage applications

P Kerber, Q Zhang, S Koswatta… - IEEE Electron Device …, 2012 - ieeexplore.ieee.org
Investigation of gate-induced drain leakage (GIDL) in thick-oxide dual-gate doped-and
undoped-channel FinFET devices through 3-D process and device simulations is presented …

3-D-TCAD-based parasitic capacitance extraction for emerging multigate devices and circuits

AN Bhoj, RV Joshi, NK Jha - IEEE transactions on very large …, 2013 - ieeexplore.ieee.org
In recent years, the multigate field-effect transistor (FET) has emerged as the most viable
contender for technology scaling down to the sub-10-nm nodes. The nonplanar nature of …

Series resistance reduction in stacked nanowire FETs for 7-nm CMOS technology

AK Bansal, I Jain, TB Hook… - IEEE Journal of the …, 2016 - ieeexplore.ieee.org
Vertically stacked nanowire field effect transistors currently dominate the race to become
mainstream devices for 7-nm CMOS technology node. However, these devices are likely to …

Comparative analysis of junctionless and inversion-mode nanosheet FETs for self-heating effect mitigation

G Kim, H Kim, S Kim, JH Kim - Semiconductor Science and …, 2023 - iopscience.iop.org
Artificial intelligence computing requires hardware like central processing units and graphic
processing units for data processing. However, excessive heat generated during …

Fin width and bias dependence of the response of triple-gate MOSFETs to total dose irradiation

JJ Song, BK Choi, EX Zhang… - … on Nuclear Science, 2011 - ieeexplore.ieee.org
The total ionizing dose response of triple-gate MOSFETs is investigated for various fin
widths and bias conditions. Experiments and simulations are used to analyze the buildup of …

Beyond-CMOS Nanodevices 1

F Balestra - 2014 - books.google.com
This book offers a comprehensive review of the state-of-the-art in innovative Beyond-CMOS
nanodevices for develo** novel functionalities, logic and memories dedicated to …