This paper uses a multi-scale crystal plasticity modelling approach to investigate the role of
microstructure in the damage of Sn-3Ag-0.5 Cu (wt%, SAC305) solder joints subject to …

TSV-Cu is widely used for chip interconnects, where high testing costs and complex crystal
plasticity finite element (CPFE) limit the research of its deep microplastic evolution process …

Improving the formability of sheet metal is a constant challenge in microforming. In this study,
applying normal stresses to the specimen surface is found to be an effective method for …

CrCoNi medium-entropy alloys (MEAs), characterised by their high configurational
entropies, have become a research hotspot in materials science. Recent studies have …

In this study, we explore the mechanisms underlying the exceptional intrinsic strength of face-
centered cubic (FCC) Multi-Principal Element Alloys (MPEAs) using a multifaceted …

In order to help comprehend the influence of short-range order (SRO) structures on both the
mechanical property and microstructural evolution of single crystalline medium entropy …

The rapidly increasing scientific interest in 3D-printed high-entropy alloys (HEAs)
necessitates the understanding of their deformation mechanisms. Here, we present the grain …

Due to the significant scale and complex operating conditions of drive shafts, experimental
analysis of small crack evolution becomes challenging. This study presents a cross-scale …

The demand for high-computing-power AI chips in the consumer electronics market is
driving the development of electronic packaging technology toward high-reliability …

梯度晶粒结构材料通过在材料内部构筑由纳米晶, 细晶渐进过渡至粗晶的微结构,
使其展现出诸多优异的力学性能, 如高**度, 高韧性和抗疲劳性等. 工程材料在长期服役过程中 …