The rapid growing technological advancement in various miniatures thermal systems
dissipate higher amount of heat. Hence, the miniature heat sinks such as mini channel and …

Active liquid cooling technique with great efficiency not only reduces power consumption but
also effectively dissipates high heat flux. In this study, a manifold-microchannel heat sink …

Electrification is critical to decarbonizing society, but managing increasing power
densification in electrical systems will require the development of new thermal management …

The utilization of a hierarchical microstructure and three-dimensional (3D) manifold for liquid
delivery and liquid/vapor extraction could potentially improve the single-phase/two-phase …

A qualitative observation has been undergone to review the various geometries of a
microchannel that has been reported for the last two decades in literature majorly for the …

In this article, we describe a new approach for the compact and energy-efficient cooling of
converters where multiple miniaturized microfluidic cold plates are attached to transistors …

A high-efficiency three-dimensionally (3-D) shaped polymer multi-jet im**ement cooler
based on cost-efficient fabrication techniques is introduced for the cooling of high-power …

Thermal management poses a critical challenge in the design of modern electronic
packages. This letter presents a diamond-on-chip-on-glass interposer (DoCoG) technology …

High-performance, high-reliability microelectronic devices are essential for many
applications. Thermal management is required to ensure that the temperature of …

Diamond heat-spreaders for gallium nitride (GaN) devices currently depend upon a robust
wafer bonding process. Bonding-free membrane methods demonstrate potential, however …