A review of recent advances in thermal management in three dimensional chip stacks in electronic systems
V Venkatadri, B Sammakia, K Srihari, D Santos - 2011 - asmedigitalcollection.asme.org
Three dimensional (3D) integration offers numerous electrical advantages like shorter
interconnection distances between different dies in the stack, reduced signal delay, reduced …
interconnection distances between different dies in the stack, reduced signal delay, reduced …
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for
overcoming the barriers in interconnect scaling, offering an opportunity to continue the …
overcoming the barriers in interconnect scaling, offering an opportunity to continue the …
Data center energy conservation study utilizing loop heat pipes as a chip-level cooling technique and its industrial application
ZH Xue, BC Ai, W Qu - Applied Thermal Engineering, 2023 - Elsevier
The thermal management and energy consumption for data centers became an increasing
challenge due to a significant increase in their number, size and power density in modern …
challenge due to a significant increase in their number, size and power density in modern …
Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints
3D multicore systems with stacked DRAM have the potential to boost system performance
significantly; however, this performance increase may cause 3D systems to exceed the …
significantly; however, this performance increase may cause 3D systems to exceed the …
Design optimization of PCM-based finned heat sinks for mechatronic components: A numerical investigation and parametric study
This paper presents an efficient numerical investigation of a PCM-based heat sink for the
purpose of thermal management, that leads to determine its optimal configuration. This study …
purpose of thermal management, that leads to determine its optimal configuration. This study …
Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and Joule heating effects
In this paper, the electrical-thermal co-simulation of 3D systems with Joule heating, fluidic
cooling and air convection effects is proposed. The finite-volume method formulations of …
cooling and air convection effects is proposed. The finite-volume method formulations of …
A vision for thermally integrated photonics systems
Thermal management has traditionally been relegated to the last step in the design process.
However, with the exponential growth in data traffic leading to ever-greater levels of …
However, with the exponential growth in data traffic leading to ever-greater levels of …
TAP-2.5 D: A thermally-aware chiplet placement methodology for 2.5 D systems
Heterogeneous systems are commonly used today to sustain the historic benefits we have
achieved through technology scaling. 2.5 D integration technology provides a cost-effective …
achieved through technology scaling. 2.5 D integration technology provides a cost-effective …
PACT: An extensible parallel thermal simulator for emerging integration and cooling technologies
Thermal analysis is an essential step that enables co-design of the computing system (ie,
integrated circuits and computer architectures) with the cooling system (eg, heat sink) …
integrated circuits and computer architectures) with the cooling system (eg, heat sink) …
Energy-efficient multiobjective thermal control for liquid-cooled 3-D stacked architectures
3-D stacked systems reduce communication delay in multiprocessor system-on-chips
(MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF …
(MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF …