Wafer bonding is an attractive technology that can join homo/heterogeneous materials into
one composite. It has a wide range of applications in the micro-electro-mechanical system …

The integration of micro-and nanoelectronics into or onto biomedical devices can facilitate
advanced diagnostics and treatments of digestive disorders, cardiovascular diseases, and …

Advanced technologies that can establish intimate, long‐lived functional interfaces with
neural systems have attracted increasing interest due to their wide‐ranging applications in …

Wearable and implantable bioelectronics have experienced remarkable progress over the
last decades. Bioelectronic devices provide seamless integration between electronics and …

The realization of quantum sensors using spin defects in semiconductors requires a
thorough understanding of the physical properties of the defects in the proximity of surfaces …

There has been increasing interest in electronic systems with integrated microfluidic active
cooling modules. However, the failure of 3C‐SiC/Si interface with increasing temperature …

This paper presents an all-SiC fiber-optic Fabry-Perot (FP) pressure sensor based on the
hydrophilic direct bonding technology for the applications in the harsh environment. The …

This paper presents highly sensitive pressure sensors using piezoresistive nanowires. Our
approach is based on nanowires locally fabricated on free standing structures with a high …

This paper presents a silicon carbide (SiC) based thermal flow sensor on a transparent and
electrically insulating glass substrate via anodic bonding process. The paper elaborates on …

We propose a plasma-activated direct bonding process at low temperatures (≤ 200° C) to
form heterostructures between single-crystalline SiC and conventional Si-based substrates …