Failure mechanisms in flexible electronics

Z Zhao, H Fu, R Tang, B Zhang, Y Chen… - International Journal of …, 2023 - Taylor & Francis
The rapid evolution of flexible electronic devices promises to revolutionize numerous fields
by expanding the applications of smart devices. Nevertheless, despite this vast potential, the …

Flexible electronics manufacturing technology and equipment

ZP Yin, YA Huang, H Yang, JK Chen, YQ Duan… - Science China …, 2022 - Springer
Flexible electronics such as mechanically compliant displays, sensors and solar cells, have
important applications in the fields of energy, national defence and biomedicine, etc. Various …

Printing of Nano‐to Chip‐Scale Structures for Flexible Hybrid Electronics

A Christou, S Ma, A Zumeit, AS Dahiya… - Advanced Electronic …, 2023 - Wiley Online Library
Flexible hybrid electronics (FHE) offers potential for fast computation and communication
needed in applications such as human–machine interfaces, electronic skin, etc. FHE …

Challenges of high-yield manufacture in micro-light-emitting diodes displays: chip fabrication, mass transfer, and detection

B Yu, Y Li, J Li, X Ding, Z Li - Journal of Physics D: Applied …, 2024 - iopscience.iop.org
Micro-light-emitting diode (micro-LED) is a promising display technology that offers
significant advantages, including superior brightness, resolution, contrast, energy …

Mass transfer for Micro-LED display: Transfer printing techniques

C Linghu, S Zhang, C Wang, H Luo, J Song - Semiconductors and …, 2021 - Elsevier
Micro-LED display, which is regarded as the next-generation display technology, has
obtained immense attention and great development during the past 2 decades. Mass …

Dynamic peeling process of IC chip from substrate based on a 3D analytical model

J Fu, W Du, H Hou, X Zhao, T Wu - International Journal of Solids and …, 2023 - Elsevier
A 3D analytical approach is proposed to investigate the peeling mechanism of IC chip from
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …

Mechanics analysis and experimental study of ultra-thin chip peeling from pre-stretching substrates

S Chen, K Shi, Z Kong, Y Ma, X Feng - International Journal of Solids and …, 2025 - Elsevier
Successful chip peeling from a substrate facilitates the transfer process for obtaining the final
functional chips, but remains a challenge in the practical production of ultra-thin chips …

[HTML][HTML] Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing

S Chen, W Lyu, G Wang, Y Chen, Y Ma… - International Journal of …, 2021 - Elsevier
Chip peeling-off, mainly accomplished through the cooperation of needle-ejecting and
vacuum-absorbing, plays a critical role in chip transferring process. However, there are few …

Transient responses of curved array flexible electronic components by finite element analysis

W Yang, C Bian, Z Kong, F Miao - Extreme Mechanics Letters, 2024 - Elsevier
This article established a finite element analysis model for the transient responses of the
curved array flexible electronic component, analyzed the influence on the order of the silicon …

Design of stretchable electronics against impact

JH Yuan, M Pharr, X Feng… - Journal of applied …, 2016 - asmedigitalcollection.asme.org
Stretchable electronics offer soft, biocompatible mechanical properties; these same
properties make them susceptible to device failure associated with physical impact. This …