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Failure mechanisms in flexible electronics
The rapid evolution of flexible electronic devices promises to revolutionize numerous fields
by expanding the applications of smart devices. Nevertheless, despite this vast potential, the …
by expanding the applications of smart devices. Nevertheless, despite this vast potential, the …
Flexible electronics manufacturing technology and equipment
Flexible electronics such as mechanically compliant displays, sensors and solar cells, have
important applications in the fields of energy, national defence and biomedicine, etc. Various …
important applications in the fields of energy, national defence and biomedicine, etc. Various …
Printing of Nano‐to Chip‐Scale Structures for Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) offers potential for fast computation and communication
needed in applications such as human–machine interfaces, electronic skin, etc. FHE …
needed in applications such as human–machine interfaces, electronic skin, etc. FHE …
Challenges of high-yield manufacture in micro-light-emitting diodes displays: chip fabrication, mass transfer, and detection
Micro-light-emitting diode (micro-LED) is a promising display technology that offers
significant advantages, including superior brightness, resolution, contrast, energy …
significant advantages, including superior brightness, resolution, contrast, energy …
Mass transfer for Micro-LED display: Transfer printing techniques
Micro-LED display, which is regarded as the next-generation display technology, has
obtained immense attention and great development during the past 2 decades. Mass …
obtained immense attention and great development during the past 2 decades. Mass …
Dynamic peeling process of IC chip from substrate based on a 3D analytical model
J Fu, W Du, H Hou, X Zhao, T Wu - International Journal of Solids and …, 2023 - Elsevier
A 3D analytical approach is proposed to investigate the peeling mechanism of IC chip from
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …
Mechanics analysis and experimental study of ultra-thin chip peeling from pre-stretching substrates
S Chen, K Shi, Z Kong, Y Ma, X Feng - International Journal of Solids and …, 2025 - Elsevier
Successful chip peeling from a substrate facilitates the transfer process for obtaining the final
functional chips, but remains a challenge in the practical production of ultra-thin chips …
functional chips, but remains a challenge in the practical production of ultra-thin chips …
[HTML][HTML] Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing
S Chen, W Lyu, G Wang, Y Chen, Y Ma… - International Journal of …, 2021 - Elsevier
Chip peeling-off, mainly accomplished through the cooperation of needle-ejecting and
vacuum-absorbing, plays a critical role in chip transferring process. However, there are few …
vacuum-absorbing, plays a critical role in chip transferring process. However, there are few …
Transient responses of curved array flexible electronic components by finite element analysis
W Yang, C Bian, Z Kong, F Miao - Extreme Mechanics Letters, 2024 - Elsevier
This article established a finite element analysis model for the transient responses of the
curved array flexible electronic component, analyzed the influence on the order of the silicon …
curved array flexible electronic component, analyzed the influence on the order of the silicon …
Design of stretchable electronics against impact
Stretchable electronics offer soft, biocompatible mechanical properties; these same
properties make them susceptible to device failure associated with physical impact. This …
properties make them susceptible to device failure associated with physical impact. This …