A thermal force-directed placement algorithm, called TFPA, based on heat conduction
analogy, is proposed for MCM design. TFPA begins with the transformation of the real …

The thermal mode analysis is used in this paper to optimize the thermal management with
optimal locations and chip sizes for multi-chip package. The average thermal resistance is …

While a PHC (power hybrid circuit) laid out for optimizing reliability could be unroutable or
extremely time consuming, a PHC laid out for optimizing wireability could have poor …

Heat transfer rates were experimentally measured in an air-filled two-dimensional simplified
model of a naturally cooled rectangular enclosure with a concentrated energy source …

The chip placement problem of multichip module (MCM) designs is to map the chips
properly to the chip sites on the MCM substrate. Chip placement affects not only the thermal …

The methodology and results of an optimization of placement of components on a printed
circuit board using Simulated Annealing method (SA), Tabu Search (TS), and Genetic …

A fast method for calculation of the temperature map in thick film, high-power hybrid IC's is
presented. Based upon the method, a way of automatic placement of the elements which …

Με επιφύλαξη κάθε δικαιώµατος. All rights reserved Απαγορεύεται η αντιγραφή, αποθήκευση
και διανοµή της παρούσας εργασίας, εξολοκλήρου ή τµήµατος αυτής, για εµπορικó σκοπó …

Με επιφφλαξθ κάκε δικαιϊματοσ. All rights reserved Απαγορεφεται θ αντιγραφι, αποκικευςθ
και διανομι τθσ παροφςασ εργαςίασ, εξολοκλιρου ι τμιματοσ αυτισ, για εμπορικό ςκοπό …

1. Περίληψη Η μελέτη που ακολουθεί αναφέρεται στη δημοσίευση του κ. **g Lee με θέμα
«Thermal Placement Algorithm Based on Heat Conduction Analogy». Πρόκειται για έναν …