Polishing processes are critical to high value production processes such as IC
manufacturing. The fundamental material removal mechanisms, howeve, are poorly …

Chemical mechanical planarization (CMP) has become one of the most critical processes in
semiconductor device fabrication to achieve global planarization. To achieve an efficient …

During chemical–mechanical polishing (CMP) in the fabrication of advanced semiconductor
devices, undesirable nano-scale scratches are produced, especially in the presence of low …

A multi-scale model encompassing pad response and slurry behavior is developed to
predict scratch propensity in a chemical mechanical planarization (CMP) process. The pad …

Paired polishing process (PPP) is a variant of the chemical mechanical polishing process
which facilitates defect mitigation via minimization of maximum force as well as effective …

Stress dependent electrochemical dissolution is identified as one of the key mechanisms
governing surface degradation in fretting and crevice corrosion of biomedical implants. The …

Chemical mechanical polishing (CMP) is a manufacturing process that is commonly used to
planarize integrated circuits and other small-scale devices during fabrication. Although a …

The abrasive effect of particles is one of the basic mechanical actions in chemical
mechanical polishing (CMP). In this paper, numerical simulations of particle sliding …

Chemical mechanical polishing (CMP) is a powerful fabrication technique that uses
chemical oxidation and mechanical abrasion to remove material and achieve very high …

A novel material removal model as a function of abrasive particle size and concentration
was established in chemical mechanical polishing (CMP) based on molecular scale …