Within the expanding domain of electrical power demand, the future of power module
packaging is entwined with the progress of (ultra) wide bandgap [(U) WBG] materials. These …

In the ever-growing landscape of electrical power demand, the future of power electronics
module packaging lies in the realm of wide-bandgap (WBG) materials, including silicon …

In order to address the contradiction that breakdown strength and thermal conductivity of
materials are difficult to improve simultaneously, we report a novel calcined silicon …

The blocking voltage of silicon carbide (SiC) device is greater than 10 kV. High voltage can
cause high electric field inside SiC power module. Improving the insulation properties of the …

The need for power modules has been promoted by the emergence of electric vehicles. The
requirements of small volume, high integrity, and high reliability for the next-generation …

Epoxy encapsulation is a promising technique to reduce the size of the power module. Its
reliability is a key aspect. Many previous studies developed new epoxy materials or new …

This study introduces a novel strategy to enhance the high‐temperature electrical
performance of the silicone elastomer (SE), while ensuring control over its thermal and …

With the proliferation of high-voltage, high-power density devices, insulation failure has
emerged as a latent hazard in power modules. Notably, breakdown along ceramic substrate …

The development of high-voltage high-power density electronic devices has brought forward
new requirements for the insulation reliability of encapsulation. The growth of electrical trees …

A vast majority of research on (U) WBG power modules has been going on to implement
nonlinear resistive field grading material on metal-brazed substrates in reducing the electric …