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Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
US8877648B2 - Methods of forming printable integrated circuit devices by selective etching to
suspend the devices from a handling substrate and devices formed thereby - Google Patents …
suspend the devices from a handling substrate and devices formed thereby - Google Patents …
Method of manufacturing a mechanical resonating structure
F Thalmayr, JH Kuypers, KJ Schoepf - US Patent 9,762,202, 2017 - Google Patents
US9762202B2 - Method of manufacturing a mechanical resonating structure - Google Patents
US9762202B2 - Method of manufacturing a mechanical resonating structure - Google Patents …
US9762202B2 - Method of manufacturing a mechanical resonating structure - Google Patents …
Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch
MA Guillorn, F Liu, Y Zhang - US Patent 8,440,523, 2013 - Google Patents
BACKGROUND MEMS relate to a technology of very small electrically driven mechanical
devices. MEMS converges at the nano scale with NEMS and nanotechnology in general …
devices. MEMS converges at the nano scale with NEMS and nanotechnology in general …
Integration of piezoelectric materials with substrates
DM Chen, JH Kuypers, A Gaidarzhy… - US Patent …, 2014 - Google Patents
Devices having piezoelectric material structures integrated with substrates are described.
Fabrication techniques for forming Such devices are also described. The fabrication may …
Fabrication techniques for forming Such devices are also described. The fabrication may …
Method of manufacturing a micro-electro-mechanical system (MEMS)
AK Stamper, JG Twombly - US Patent 8,458,888, 2013 - Google Patents
6,897,537 6,917,086 7,008,812 7,019,434 7,064,637 7,138,745 7,180,145 7,294.282
7,299,538 7,344,907 7,361,962 7.388, 316 7,394,332 7,402,449 7,545,622 7,579,663 …
7,299,538 7,344,907 7,361,962 7.388, 316 7,394,332 7,402,449 7,545,622 7,579,663 …
Electromechanical magnetometer and applications thereof
P Mohanty - US Patent 9,383,208, 2016 - Google Patents
US9383208B2 - Electromechanical magnetometer and applications thereof - Google Patents
US9383208B2 - Electromechanical magnetometer and applications thereof - Google Patents …
US9383208B2 - Electromechanical magnetometer and applications thereof - Google Patents …
Planar cavity MEMS and related structures, methods of manufacture and design structures
GA Dunbar III, JC Maling, WJ Murphy… - US Patent …, 2015 - Google Patents
(57) ABSTRACT A Micro-Electro-Mechanical System (MEMS). The MEMS includes a lower
chamber with a wiring layer and an upper chamber which is connected to the lower …
chamber with a wiring layer and an upper chamber which is connected to the lower …
Planar cavity MEMS and related structures, methods of manufacture and design structures
RT Herrin, CV Jahnes, AK Stamper, EJ White - US Patent 8,956,903, 2015 - Google Patents
(57) ABSTRACT A method of forming at least one Micro-Electro-Mechanical System (MEMS)
cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The …
cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The …
Mechanical resonating structures including a temperature compensation structure
DM Chen, JH Kuypers, A Gaidarzhy… - US Patent …, 2011 - Google Patents
Mechanical resonators are physical structures that are designed to vibrate at high
frequencies. Such resonators may be incorporated into a variety of devices Such as timing …
frequencies. Such resonators may be incorporated into a variety of devices Such as timing …
Planar cavity MEMS and related structures, methods of manufacture and design structures
CV Jahnes, AK Stamper - US Patent 8,685,778, 2014 - Google Patents
(57) ABSTRACT A method of forming at least one Micro-Electro-Mechanical System (MEMS)
cavity includes forming a first sacrificial cavity layer over a lower wiring layer. The method …
cavity includes forming a first sacrificial cavity layer over a lower wiring layer. The method …