During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–
Pb solder alloys. Since the miniaturization of electronic products and the expansion of …

Heavy metals (HMs) pose significant health risks when consumed, necessitating accurate
detection and removal strategies. This review surveyed the recent advancements in …

Abstract Sn3Ag0. 5Cu (SAC305) Ball Grid Array (BGA) solder joints were exposed to 60 Co
source gamma irradiation at a dose rate of 1 Gy (Si)/s from 0 to 200 h in air. The effects of …

With the ongoing advancements and innovations of electronic device, the demand for low-
melting-point solder is rising, especially for flexible printed electronics. The service …

In the electronics industry, graphene is applied with modified lead-free solder. This review
presents advances in the preparation, strengthening mechanisms, and property …

Corrosion on electronic component terminations during assembly can lead to the failure of
electronic devices. The terminations of electronic components are susceptible to corrosion …

Corrosion is one of the main end-of-life degradation and failure modes in photovoltaic (PV)
modules. However, it is a gradual process and can take many years to become a major risk …

Oxide film formed on Sn-based lead-free solder surface plays an important role in protecting
the solder joints in electronic devices. However, corrosion resistance of oxide film varied …

Tin–silver–copper (SAC) solder alloys are the most promising candidates to replace Sn–Pb
solder alloys. However, their application is still facing several challenges; one example is …