The development of microelectronics and large-scale intelligence nowadays promotes the
integration, miniaturization, and multifunctionality of electronic and devices but also leads to …

Diamond-like carbon (DLC) is a metastable form of amorphous carbon with significant sp3
bonding. DLC is a semiconductor with a high mechanical hardness, chemical inertness, and …

Modern computer microprocessor chips are marvels of engineering complexity. For the
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …

Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

The ever increasing requirements for electrical performance of on-chip wiring has driven
three major technological advances in recent years. First, copper has replaced Aluminum as …

Nanoscience and nanotechnology are tremendously increasing fields of research that aim at
producing, characterizing and understanding nanoobjects and assemblies of nanoobjects …

An original design strategy for the preparation of polymers with a low dielectric constant is
presented. The key to this design strategy is taking the most advantage of the secondary …

Graphene ranks highly as a possible material for future high-speed and flexible electronics.
Current fabrication routes, which rely on metal substrates, require post-synthesis transfer of …

With the rapid development of ultra-large-scale integration (ULSI) of integrated circuits, the
feature size of the silicon chip continues shrinking and the physical gate length is …

A bulk dielectric polymer film with an intrinsic ultralow k value of 1.52 at 10 kHz has been
successfully synthesized based on a novel polyimide FPTTPI. More importantly, such …