In order to take the full advantage of the high-temperature SiC and GaN operating devices,
package materials able to withstand high-temperature storage and large thermal cycles …

There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …

With increased need for high power density, high efficiency and high temperature
capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a …

Abstract 3 mm× 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization
have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based …

The employment of sintered silver (SAG) as die attach material is one of the most promising
solutions to utilize the advantages of wide bandgap semiconductors in modern power …

Currently, the demand by new application scenarios of increasing operating device
temperatures in power systems is requiring new die-attach materials with higher melting …

13.5 mm× 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates
were prepared at 250° C and a pressure of 10 MPa for 5 min and compared with Pb5Sn …

High-performance, high-reliability microelectronic devices are essential for many
applications. Thermal management is required to ensure that the temperature of …

Pressureless sintering of nanosilver paste has been widely demonstrated for bonding power
semiconductor devices on silver-or gold-coated substrates. In this paper, we extended the …

A micro-sized Ag paste was fabricated with the metal content of approximately 85% as a
sinter-bonding material in this study. The sintering reactions and joint strengths of Ag …