Ultrasound devices and methods are described, including a repeatable ultrasound
transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and an output data module …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) sub strates are described, as well as methods of fabricating Such …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and a high-speed serial data …

2014-04-22 Assigned to BUTTERFLY NETWORK, INC. reassignment BUTTERFLY
NETWORK, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR …

Complementary metal oxide semiconductor (CMOS) ultra sonic transducers (CUTs) and
methods for forming CUTs are described. The CUT's may include monolithically integrated …

Aspects of the technology described herein relate to ultra Sound device circuitry as may form
part of a single Substrate ultrasound device having integrated ultrasonic transducers. The …

US 2014/0217478 A1 Aug. 7, 2014(Continued) Primary Examiner—Zandra Smith Related
US Application Data Assistant Examiner—Lawrence Tynes, Jr.(60) Provisional application …

Micromachined ultrasonic transducers formed in comple mentary metal oxide semiconductor
(CMOS) wafers are described, as are methods of fabricating Such devices. A metallization …

In an embodiment, a transducer device has a flexible substrate and a plurality of tiles
coupled to the substrate. The tiles each include a plurality of piezoelectric transducer …