Top 10 directions in lithography 3D printing

R Melentiev, M Melentieva, N Yu - Bioprinting, 2024 - Elsevier
Lithography 3D printing technologies such as stereolithography (SLA), two-photon
polymerization (TPP), digital light processing (DLP), and other approaches based on vat …

Porous lithiophilic Cu-Sn solid solution current collector for dendrite-free lithium metal batteries

X Fei, H Gao, Y Xu, W Ma, B Yu, F Tan, G Cheng… - Energy Storage …, 2024 - Elsevier
Lithium metal batteries (LMBs) have high energy density but suffer from the formation of Li
dendrites and unstable solid electrolyte interface. Herein, a three-dimensional porous Cu-Sn …

Map** the coating failure modes of electroless plated metal on ABS polymer with micro-nano structured interface

R Melentiev, R Tao, X Li, AK Tevtia, N Verghese… - International Journal of …, 2023 - Elsevier
Electroless plating is the default industrial process for depositing glossy metallic coatings on
polymeric parts, most often made of acrylonitrile–butadiene–styrene (ABS) plastic …

[HTML][HTML] Fabrication of permanent self-lubricating 2D material-reinforced nickel mould tools using electroforming

H Zhang, T Guan, N Zhang, F Fang - International Journal of Machine Tools …, 2021 - Elsevier
In the replication of polymeric micro/nano structures, adhesion and friction between mould
tool and polymer cause significant feature failure. For the first time, this work developed a …

Additives induced localized electrodeposition manufacturing of high quality copper micro-rectangular solid structures

Z Zou, J Xu, W Ren, M Wang, Z Xu, X Wang… - Journal of Materials …, 2023 - Elsevier
High-performance rectangular solid structures at the scale of 10–50 µm are extensively
utilized in the fields of optical engineering and bioengineering. However, producing high …

New precision electroforming process for the simultaneous improvement of thickness uniformity and microstructure homogeneity of wafer-scale nanotwinned copper …

X Zhan, C Shen, Z Zhu, D Zhu - International Journal of Machine Tools and …, 2023 - Elsevier
Nanotwinned (nt) Cu has received much attention because of its superior mechanical and
electrical properties, but only a few production processes can yield nt-Cu parts with uniform …

[HTML][HTML] Atomic-scale understanding of microstructural evolution in electrochemical additive manufacturing of metallic nickel

H Zhang, K Chen, C Kang, H Liu - Materials & Design, 2024 - Elsevier
Atomic-level manufacturing is fundamentally concerned with the precise removal, addition,
and migration of material at the atomic and close-to-atomic scale (ACS). Tip-based …

Influence of phosphorous acid concentration on the self-lubricating properties of electroformed Ni-P-PTFE ternary composites

Z Ma, B Jiang, D Drummer, L Zhang - Surface and Coatings Technology, 2024 - Elsevier
In micro-injection molding, polymer/mold interface adhesion may cause severe deformation
or damage of micro features on the molded products. To reduce the interface adhesion and …