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Microstructure evolution and shear fracture behavior of aged Sn3Ag0. 5Cu/Cu solder joints
X Hu, T Xu, LM Keer, Y Li, X Jiang - Materials Science and Engineering: A, 2016 - Elsevier
The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0. 5Cu/Cu
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …
Shear strength and fracture behavior of reflowed Sn3. 0Ag0. 5Cu/Cu solder joints under various strain rates
X Hu, T Xu, LM Keer, Y Li, X Jiang - Journal of Alloys and Compounds, 2017 - Elsevier
The effects of strain rate on the shear fracture behavior of Sn3. 0Ag0. 5Cu/Cu solder joints
with thin and thick interfacial intermetallic compound layers were investigated. A single lap …
with thin and thick interfacial intermetallic compound layers were investigated. A single lap …
Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints
This paper investigated the effect of Bi, Ni concentration on the microstructure and interfacial
intermetallic compounds of low-Ag Sn–0.7 Ag–0.5 Cu–xBi–yNi/Cu solder joints by …
intermetallic compounds of low-Ag Sn–0.7 Ag–0.5 Cu–xBi–yNi/Cu solder joints by …
Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking
To meet the demand of cryogenic reliability on the electronic packaging for deep space
satellite, the three-dimensional interfacial morphology and property of eutectic SnPb solder …
satellite, the three-dimensional interfacial morphology and property of eutectic SnPb solder …
[HTML][HTML] Size effects on IMC growth of Cu/Ni/Sn-3.5 Ag microbump joints during isothermal aging and prediction of shear strength using ANN
C Tang, Z Chen, M Fang, X **ao, G Chen… - Journal of Materials …, 2022 - Elsevier
Significant downsizing trend is currently directing the advanced microelectronic packaging
industry, which poses new challenges to the manufacturing process and reliability of high …
industry, which poses new challenges to the manufacturing process and reliability of high …
Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as
an alternative to lead-free surface finish in electronic industry for the reduction of metal cost …
an alternative to lead-free surface finish in electronic industry for the reduction of metal cost …
Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging
Different from the conventional aging induced continuous mechanical performance
deterioration in solder joints, a counter-intuitive “decrease-increase-decrease” variation in …
deterioration in solder joints, a counter-intuitive “decrease-increase-decrease” variation in …
Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing
SH Hu, TC Lin, CL Kao, FY Huang, YY Tsai… - Microelectronics …, 2021 - Elsevier
Bi additions have been reported to improve the wettability and drop-impact performance.
Most important of all, it improves the mechanical properties. However, few studies focus on …
Most important of all, it improves the mechanical properties. However, few studies focus on …
Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3. 0Ag0. 5Cu/Ni solder joints
HB Qin, XP Zhang, MB Zhou, JB Zeng… - Materials Science and …, 2014 - Elsevier
Solder joints are generally regarded as the weakest part in packaging systems and
electronic assemblies in modern electronic products and devices. In this study, both …
electronic assemblies in modern electronic products and devices. In this study, both …
Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic …
P Yao, X Li, X Han, L Xu - Soldering & Surface Mount Technology, 2019 - emerald.com
Purpose This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn
IMCs joints with different Cu3Sn proportion and joints with the conventional interfacial …
IMCs joints with different Cu3Sn proportion and joints with the conventional interfacial …