Review of Si-based GeSn CVD growth and optoelectronic applications

Y Miao, G Wang, Z Kong, B Xu, X Zhao, X Luo, H Lin… - Nanomaterials, 2021 - mdpi.com
GeSn alloys have already attracted extensive attention due to their excellent properties and
wide-ranging electronic and optoelectronic applications. Both theoretical and experimental …

Progress on germanium–tin nanoscale alloys

J Doherty, S Biswas, E Galluccio… - Chemistry of …, 2020 - ACS Publications
Group IV alloys have attracted interest in the drive to create Si compatible, direct band gap
materials for implementation in complementary metal oxide semiconductor (CMOS) and …

Lasing in Group-IV materials

V Reboud, D Buca, H Sigg, JM Hartmann… - Silicon Photonics IV …, 2021 - Springer
Silicon photonics in the near-IR, up to 1.6 µm, is already one of key technologies in optical
data communications, particularly short range. It also is being prospected for applications in …

Amorphous InGaZnO thin-film transistors with sub-10-nm channel thickness and ultrascaled channel length

S Samanta, K Han, C Sun, C Wang… - … on Electron Devices, 2021 - ieeexplore.ieee.org
We investigate the effect of channel layer thickness on effective mobility (μeff) in the sub-10-
nm regime of amorphous indium-gallium-zinc-oxide thin-film transistors (α-IGZO TFTs). TFT …

Growth mode control for direct-gap core/shell Ge/GeSn nanowire light emission

AC Meng, MR Braun, Y Wang, S Peng, W Tan, JZ Lentz… - Materials Today, 2020 - Elsevier
Germanium-tin is a promising semiconductor alloy system for novel light emitting devices
and optical sensors in the mid-IR region. For sufficiently high Sn compositions, the material …

High performance junctionless FDSOI SiGe channel p-FinFET with high ION/IOFF ratio and excellent SS

H Lin, X Zhao, X Luo, Y Miao, Y Zhang, Z Kong… - Materials Science in …, 2024 - Elsevier
This paper presents a novel FDSOI FinFETs with SiGe channel/Si cap layer (35 nm/5 nm)
formed on SOI wafers with 20 nm Si body. Electrical characterization result shows that JL …

Low-Temperature Processed Ni/GeSn Optimal Contacts for Junctionless GeSnSi FinFETs

S Choudhary, D Schwarz, HS Funk… - … on Electron Devices, 2024 - ieeexplore.ieee.org
For junctionless FETs (JLFETs), an optimal ohmic contact is needed to achieve maximum
drive current. The scaling of the source/drain (S/D) contact area impacts the contact …

Uniform 4-Stacked Ge0.9Sn0.1 Nanosheets Using Double Ge0.95Sn0.05 Caps by Highly Selective Isotropic Dry Etch

CT Tu, YS Huang, CY Cheng, CE Tsai… - … on Electron Devices, 2021 - ieeexplore.ieee.org
The undoped 4-stacked Ge 0.9 Sn 0.1 nanosheets sandwiched by double Ge 0.95 Sn 0.05
caps without parasitic Ge channels underneath are realized by a radical-based highly …

Highly stacked GeSn nanosheets by CVD epitaxy and highly selective isotropic dry etching

BW Huang, CE Tsai, YC Liu, CT Tu… - … on Electron Devices, 2022 - ieeexplore.ieee.org
The eight stacked Ge 0.9 Sn 0.1 ultrathin bodies down to 3 nm with high and eight stacked
Ge 0.9 Sn 0.1 thick nanosheets with high per stack are demonstrated. For the eight stacked …

Field-Effect Transistor Figures of Merit for Vapor–Liquid–Solid-Grown Ge1-xSnx (x = 0.03–0.09) Nanowire Devices

E Galluccio, J Doherty, S Biswas… - ACS Applied …, 2020 - ACS Publications
Ge1-x Sn x alloys form a heterogeneous material system with high potential for applications
in both optoelectronic and high-speed electronics devices. The attractiveness of Ge1-x Sn x …