Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review
CS Lau, CY Khor, D Soares, JC Teixeira… - Soldering & Surface …, 2016 - emerald.com
Purpose The purpose of the present study was to review the thermo-mechanical challenges
of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the …
of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the …
Smarter temperature setup for reflow oven to minimize temperature variation among components
The thermomechanical reliability of surface mount components (SMCs) is closely related to
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …
Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology
Pin-in-paste technology is an advanced and constantly develo** assembly method, where
both the surface mounted and through-hole components are joined commonly with the same …
both the surface mounted and through-hole components are joined commonly with the same …
Determination of smarter reflow profile to achieve a uniform temperature throughout a board
Uneven temperature distribution poses a big challenge on reflow soldering of surface mount
components. Particularly, when components with different thermal mass are mounted on a …
components. Particularly, when components with different thermal mass are mounted on a …
ReflowNet: ConvLSTM-based direct reflow oven recipe optimization framework
This paper presents ReflowNet, a domain-adaptive convolutional long short-term memory
(ConvLSTM) neural network-based oven recipe optimization framework for reflow soldering …
(ConvLSTM) neural network-based oven recipe optimization framework for reflow soldering …
Noncontact reflow oven thermal profile prediction based on artificial neural network
This research proposes a thermal profile prediction model in the soldering reflow process
(SRP). The thermal profile is the temperature of the solder paste during SRP and is affected …
(SRP). The thermal profile is the temperature of the solder paste during SRP and is affected …
Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan
This study presents the experimental and numerical analysis of the thermal process for
laboratory scale desktop lead-free reflow oven and discusses a 3D CFD model of radiation …
laboratory scale desktop lead-free reflow oven and discusses a 3D CFD model of radiation …
Distribution of the heat transfer coefficient in convection reflow oven
B Illés - Applied Thermal Engineering, 2010 - Elsevier
Nowadays reflow ovens apply forced convection heating with nozzle-matrix blower system
which generates numerous heater gas streams. In these types of ovens the heat transfer …
which generates numerous heater gas streams. In these types of ovens the heat transfer …
Development of a soldering quality classifier system using a hybrid data mining approach
TN Tsai - expert systems with applications, 2012 - Elsevier
Soldering failures lead to considerable manufacturing costs in the electronics assembly
industry. Soldering problems can be caused by improper parameter settings during paste …
industry. Soldering problems can be caused by improper parameter settings during paste …
Experimental and numerical study of multiple jets im**ing a step surface
Multiple jet im**ement is a widely implemented convective process for enhancing heat
transfer over target surfaces. Depending on the engineering application, the im**ing plate …
transfer over target surfaces. Depending on the engineering application, the im**ing plate …