A review of thermoreflectance techniques for characterizing wide bandgap semiconductors' thermal properties and devices' temperatures

C Yuan, R Hanus, S Graham - Journal of Applied Physics, 2022 - pubs.aip.org
Thermoreflectance-based techniques, such as pump–probe thermoreflectance (pump–
probe TR) and thermoreflectance thermal imaging (TTI), have emerged as the powerful and …

[HTML][HTML] β-Gallium oxide power electronics

AJ Green, J Speck, G **ng, P Moens, F Allerstam… - Apl Materials, 2022 - pubs.aip.org
Gallium Oxide has undergone rapid technological maturation over the last decade, pushing
it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the …

A review of direct drive proportional electrohydraulic spool valves: industrial state-of-the-art and research advancements

P Tamburrano, AR Plummer… - Journal of …, 2019 - asmedigitalcollection.asme.org
This paper reviews the state of the art of directly driven proportional directional hydraulic
spool valves, which are widely used hydraulic components in the industrial and …

Thermal management and characterization of high-power wide-bandgap semiconductor electronic and photonic devices in automotive applications

SK Oh, JS Lundh, S Shervin… - Journal of …, 2019 - asmedigitalcollection.asme.org
GaN-based high-power wide-bandgap semiconductor electronics and photonics have been
considered as promising candidates to replace conventional devices for automotive …

The effects of AlN and copper back side deposition on the performance of etched back GaN/Si HEMTs

G Pavlidis, SH Kim, I Abid, M Zegaoui… - IEEE Electron …, 2019 - ieeexplore.ieee.org
The breakdown voltage of GaN/Si high-electron-mobility transistors (HEMTs) for power
electronics has shown to be improved by removing the silicon substrate. The drawback to …

Thermal performance of GaN/Si HEMTs using near-bandgap thermoreflectance imaging

G Pavlidis, L Yates, D Kendig, CF Lo… - … on Electron Devices, 2020 - ieeexplore.ieee.org
Superlattice (SL) structures have been used to reduce the stress in the GaN epilayer of high-
electron-mobility transistors (HEMTs). This has led to an improvement in their properties …

2D materials for universal thermal imaging of micro-and nanodevices: An application to gallium oxide electronics

JS Lundh, T Zhang, Y Zhang, Z **a… - ACS Applied …, 2020 - ACS Publications
We highlight the flexibility of two-dimensional (2D) materials for advancing current
technologies through the introduction of 2D Raman thermography (2DRT). 2DRT combines …

ESD reliability of AlGaN/GaN HEMT technology

B Shankar, S Raghavan… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
This experimental study reports new aspects of electrostatic discharge (ESD) behavior in
AlGaN/GaN HEMTs. The role of Schottky gate and MESA is investigated using special test …

[HTML][HTML] Experimental and computational analysis of thermal environment in the operation of HfO2 memristors

DG Pahinkar, P Basnet, MP West, B Zivasatienraj… - AIP Advances, 2020 - pubs.aip.org
Neuromorphic computation using nanoscale adaptive oxide devices or memristors is a very
promising alternative to the conventional digital computing framework. Oxides of transition …

GaN HEMT on Si substrate with diamond heat spreader for high power applications

L Arivazhagan, A Jarndal, D Nirmal - Journal of Computational Electronics, 2021 - Springer
Currently, the GaN-on-silicon high electron mobility transistor (HEMT) is a promising
candidate to replace the Si Metal Oxide Semiconductor Field Effect Transistor (MOSFET) for …