Grinding is one of the most widely used material removal methods at the end of many
process chains. Grinding force is related to almost all grinding parameters, which has a …

The purpose of this article is to review current understanding of lithia-based glass–ceramics
and to identify future research needs for this class of dental materials in relation to novel …

The complexity of the interaction between the workpiece and abrasives, the characterisation
difficulty of the strain-rate effect, and the analytical difficulty of brittle-ductile coexistence …

Gallium nitride crystal is a typical difficult-to-machine material due to its distinct anisotropy,
high brittleness, and high hardness. The molecular dynamics simulations of traditional …

As a dielectric, biolubricant (vegetable oil) cannot maximize the efficiency of electrostatic
atomization minimum quantity lubrication (EMQL). The lecithin-enhanced technology is …

Elucidating the complex interactions between the work material and abrasives during
grinding of gallium nitride (GaN) single crystals is an active and challenging research area …

Despite being the most promising third-generation semiconductor materials, the deformation
and removal mechanisms of gallium nitride (GaN) single crystals involved in the ultra …

Grinding and lap** are two widely used machining processes for silicon wafer
planarization. Their resultant surface integrity has a significant impact on subsequent …

Abstract Laser-assisted grinding (LAG), as a potential machining method, is expected to
achieve high-efficiency machining without any surface damage or sub-surface damage …

Silicon carbide (SiC) is a promising semiconductor material for high-performance power
electronics devices, but difficult to machine. The development of cost-effective machining …