Advanced fabrication processes for superconducting very large-scale integrated circuits

SK Tolpygo, V Bolkhovsky, TJ Weir… - IEEE Transactions …, 2016 - ieeexplore.ieee.org
We review the salient features of two advanced nodes of an 8-Nb-layer fully planarized
process developed recently at MIT Lincoln Laboratory for fabricating single flux quantum …

Fabrication Process and Properties of Fully-Planarized Deep-Submicron Nb/Al– Josephson Junctions for VLSI Circuits

SK Tolpygo, V Bolkhovsky, TJ Weir… - IEEE transactions on …, 2014 - ieeexplore.ieee.org
A fabrication process for Nb/Al-AlO x/Nb Josephson junctions (JJs) with sizes down to 200
nm has been developed on a 200-mm-wafer tool set typical for CMOS foundry. This process …

Advanced fabrication processes for superconductor electronics: Current status and new developments

SK Tolpygo, V Bolkhovsky, R Rastogi… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
In superconductor electronics fabrication processes developed at MIT Lincoln Laboratory,
Josephson junctions (JJs) are placed near the top of the stack composed of nine or ten …

Inductance of superconductor integrated circuit features with sizes down to 120 nm

SK Tolpygo, EB Golden, TJ Weir… - Superconductor …, 2021 - iopscience.iop.org
Data are presented on the inductance of various features used in superconductor digital
integrated circuits: microstrip and stripline inductors with linewidths down to 120 nm and …

Improved coherence in optically defined niobium trilayer-junction qubits

A Anferov, KH Lee, F Zhao, J Simon, DI Schuster - Physical Review Applied, 2024 - APS
Niobium offers the benefit of increased operating temperatures and frequencies for
Josephson junctions, which are the core component of superconducting devices. However …

High density fabrication process for single flux quantum circuits

D Yohannes, M Renzullo, J Vivalda, AC Jacobs… - Applied Physics …, 2023 - pubs.aip.org
We implemented, optimized, and fully tested a superconducting Josephson junction
fabrication process over multiple runs tailored for integrated digital circuits that are used for …

Deep sub-micron stud-via technology of superconductor VLSI circuits

SK Tolpygo, V Bolkhovsky, T Weir… - Superconductor …, 2014 - iopscience.iop.org
A fabrication process has been developed for fully planarized Nb-based superconducting
interlayer connections (vias) with minimum size down to 250 nm for superconductor very …

System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits

SK Tolpygo, D Amparo, R Hunt, J Vivalda… - US Patent …, 2012 - Google Patents
Superconducting integrated circuits require several wiring layers to distribute bias and
signals across the circuit, which must cross each other both with and without contacts. All …

Planarized, extendible, multilayer fabrication process for superconducting electronics

DT Yohannes, RT Hunt, JA Vivalda… - IEEE Transactions …, 2014 - ieeexplore.ieee.org
We report on technique and results for superconductor electronics fabrication process,
featuring customizable number of planarized superconducting layers. The novel technique …

Disentangling superconductor and dielectric microwave losses in submicrometer / interconnects using a multimode microstrip resonator

CAT Garcia, N Bailey, C Kirby, JA Strong… - Physical Review …, 2024 - APS
An understanding of the origins of power loss in superconducting interconnects is essential
for the energy efficiency and scalability of superconducting digital logic. At microwave …