Thickness is a typical parameter related to length, of which measurements are conducted in
various industrial fields, such as the automotive, aviation, ship-building, semiconductor, and …

Nanoscale thin film coatings and surface treatments are ubiquitous across industry, science,
and engineering; imbuing specific functional or mechanical properties (such as corrosion …

Abstract Three-dimensional (3D) complementary metal–oxide–semiconductor (CMOS)
integration could enable device scaling beyond the limits of conventional 2D CMOS …

Nondestructive three-dimensional topography of high-aspect ratio structures presents
significant challenges, particularly in accurately capturing the bottom topography. Here, a …

Topography measurement of high aspect ratio trench array using coherence scanning
interferometry presents significant challenges because the numerical aperture of detection …

This work presents a new optical metrology technique for accurate depth measurement of
individual high-aspect-ratio (HAR) multi-layer microstructures with high spatial resolution …

This article presents an innovative model-based scatterometry method for CD metrology of
single high-aspect-ratio (HAR) microstructures, which are increasingly utilized in advanced …

Coherence scanning interferometry (CSI) is a non-destructive method for measuring the
microstructure surface topography, but it fails to retrieve the bottom topography because the …

This paper reports on progress in the analysis of time-domain optical coherence tomography
(OCT) applied to the dimensional metrology of through-silicon vias (TSVs), which are vertical …

As demand accelerates for multifunctional devices with a small footprint and minimal power
consumption, 2.5 D and 3D advanced packaging architectures have emerged as an …