Whisker growth in Sn coatings: a review of current status and future prospects
Whiskering is a spontaneous filamentary growth of material, and it is a major long-term
reliability issue affecting microelectronic packages comprising Sn plating and Sn-rich …
reliability issue affecting microelectronic packages comprising Sn plating and Sn-rich …
Recent advances in mitigation of whiskers from electroplated tin
Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This
problem was solved in the past by adding a few percent of Pb during Sn electroplating, but …
problem was solved in the past by adding a few percent of Pb during Sn electroplating, but …
A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments
S Tian, R Cao, J Zhou, F Xue, Y Liu, P Zhang… - Journal of Alloys and …, 2021 - Elsevier
In this study, the effects of factors such as temperature, solution and surface roughness on
the growth of whiskers in a 100 μm thick Sn-Al alloy coating were comparatively investigated …
the growth of whiskers in a 100 μm thick Sn-Al alloy coating were comparatively investigated …
Sn Whisker Growth During Mechanical Loading and Unloading: Highlighting the Critical Role of Stress in Whisker Growth
Whisker formation in metallic coatings has been studied extensively over the past few
decades. A wide consensus exists for stress as a driving force behind whisker growth …
decades. A wide consensus exists for stress as a driving force behind whisker growth …
[كتاب][B] Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders
IL Regalado - 2018 - search.proquest.com
Increasing density of microelectronic packages, results in an increase in thermal and
mechanical stresses within the various layers of the package. To accommodate the high …
mechanical stresses within the various layers of the package. To accommodate the high …