Whisker growth in Sn coatings: a review of current status and future prospects
Whiskering is a spontaneous filamentary growth of material, and it is a major long-term
reliability issue affecting microelectronic packages comprising Sn plating and Sn-rich …
reliability issue affecting microelectronic packages comprising Sn plating and Sn-rich …
Recent advances in mitigation of whiskers from electroplated tin
BS Majumdar, I Dutta, S Bhassyvasantha… - JOM, 2020 - Springer
Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This
problem was solved in the past by adding a few percent of Pb during Sn electroplating, but …
problem was solved in the past by adding a few percent of Pb during Sn electroplating, but …
A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments
S Tian, R Cao, J Zhou, F Xue, Y Liu, P Zhang… - Journal of Alloys and …, 2021 - Elsevier
In this study, the effects of factors such as temperature, solution and surface roughness on
the growth of whiskers in a 100 μm thick Sn-Al alloy coating were comparatively investigated …
the growth of whiskers in a 100 μm thick Sn-Al alloy coating were comparatively investigated …
Sn Whisker Growth During Mechanical Loading and Unloading: Highlighting the Critical Role of Stress in Whisker Growth
Whisker formation in metallic coatings has been studied extensively over the past few
decades. A wide consensus exists for stress as a driving force behind whisker growth …
decades. A wide consensus exists for stress as a driving force behind whisker growth …
[書籍][B] Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders
IL Regalado - 2018 - search.proquest.com
Increasing density of microelectronic packages, results in an increase in thermal and
mechanical stresses within the various layers of the package. To accommodate the high …
mechanical stresses within the various layers of the package. To accommodate the high …