Metal silicides in CMOS technology: Past, present, and future trends

SL Zhang, M Östling - Critical Reviews in Solid State and Materials …, 2003 - Taylor & Francis
Metal silicides have played an indispensable role in the raped development of
microelectronics since PtSi was first used to improve the rectifying characteristics of diodes …

Transition metal silicides in silicon technology

AH Reader, AH Van Ommen, PJW Weijs… - Reports on Progress …, 1993 - iopscience.iop.org
Studies of the properties and characteristics of transition metal silicides have been
stimulated by their (potential) use in integrated circuit technology. This review describes …

Enhancement of thermal stability of NiSi films on (100) Si and (111) Si by Pt addition

D Mangelinck, JY Dai, JS Pan, SK Lahiri - Applied physics letters, 1999 - pubs.aip.org
The effect of a small amount of Pt 5 at.% on the thermal stability of NiSi film on 100 and 111
Si substrates has been investigated both by in situ annealing inside an x-ray photoelectron …

Formation and characterization of transition-metal silicides

MA Nicolet, SS Lau - VLSI Electronics Microstructure Science, 1983 - Elsevier
Publisher Summary This chapter focuses on formation and characterization of transition-
metal silicides. Many deposition techniques can be applied to form thin silicide layers on …

Formation of silicide thin films by solid state reaction

P Gas, FM d'Heurle - Applied Surface Science, 1993 - Elsevier
Because of the practical interest of silicides, the M-Si thin film reaction has been thoroughly
investigated over the last two decades. This allows a systematic analysis of M-Si reactions …

Lattice and grain boundary self‐diffusion in Ni2Si: Comparison with thin‐film formation

JC Ciccariello, S Poize, P Gas - Journal of Applied physics, 1990 - pubs.aip.org
The Ni2Si lattice and grain boundary self‐diffusion parameters have been studied using
radiotracers 63Ni for Ni diffusion, 68Ge for Si diffusion, conventional sectioning techniques …

Grain boundary diffusion and growth of titanium silicide layers on silicon

YL Corcoran, AH King, N de Lanerolle… - Journal of electronic …, 1990 - Springer
A kinetics study of titanium silicide formation is described. The results show that a fine
grained precursor layer exist in between the well developed C-54 silicide layer and the …

Analysis of the diffusion controlled growth of cobalt silicides in bulk and thin film couples

T Barge, P Gas, FM d'Heurle - Journal of materials research, 1995 - cambridge.org
The solid state reaction between Co and Si has been studied in bulk diffusion couples
between 850 and 1100° C. At the scale of the observations made, the three phases Co2Si …

[LIBRO][B] VLSI electronics: microstructure science

NG Einspruch - 2014 - books.google.com
VLSI Electronics: Microstructure Science, Volume 3 evaluates trends for the future of very
large scale integration (VLSI) electronics and the scientific base that supports its …

A Xe marker study of the transformation of Ni2Si to NiSi in thin films

TG Finstad - Physica status solidi (a), 1981 - Wiley Online Library
Thin Ni films evaporated onto< 100> Si single crystals are heat treated at 340° C to yield a
layer of Ni2Si on Si. 750 keV Xe atoms are implanted to serve as Kirkendall markers for the …