Die attachment, wire bonding, and encapsulation process in LED packaging: A review
Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …
light sources with broad applications in all scientific disciplines. For the past recent years …
A comprehensive overview of reliability assessment strategies and testing of power electronics converters
Power electronics converters (PECs) are responsible for efficiently converting electrical
energy between power generators, storage systems and power consumers/loads. The PECs …
energy between power generators, storage systems and power consumers/loads. The PECs …
Real-life mission profile-oriented lifetime estimation of a SiC interleaved bidirectional HV DC/DC converter for electric vehicle drivetrains
The rapid growth of battery electric vehicles (BEVs) in the automotive field has led to the
need for improving their drivetrain performance, mainly focusing on the extension of the …
need for improving their drivetrain performance, mainly focusing on the extension of the …
A review of interconnect materials used in emerging memory device packaging: first-and second-level interconnect materials
The main motivation of this review is to study the evolution of first and second level of
interconnect materials used in memory device semiconductor packaging. Evolutions of …
interconnect materials used in memory device semiconductor packaging. Evolutions of …
Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years
The objective of this review is to study the evolution and key findings and critical technical
challenges, solutions and future trend of bonding wires used in semiconductor electronics …
challenges, solutions and future trend of bonding wires used in semiconductor electronics …
Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA
Abstract Au-coated Ag Alloys (ACA) have emerged as a new bonding wire in semiconductor
industries with lower costs for CMOS iBGA applications. However, a wide gap of study …
industries with lower costs for CMOS iBGA applications. However, a wide gap of study …
Extended reliability of gold and copper ball bonds in microelectronic packaging
Wire bonding is the predominant mode of interconnection in microelectronic packaging.
Gold wire bonding has been refined again and again to retain control of interconnect …
Gold wire bonding has been refined again and again to retain control of interconnect …
Mechanism of microweld formation and breakage during Cu–Cu wire bonding investigated by molecular dynamics simulation
Currently, wire bonding is the most popular first-level interconnection technology used
between the die and package terminals, but even with its long-term and excessive usage …
between the die and package terminals, but even with its long-term and excessive usage …
Microslip and energy dissipation behaviors of bonding interface considering rough morphology
S Cai, Y Sun, S Wu - Journal of Mechanical Science and Technology, 2024 - Springer
Lead bonding is a crucial interconnect technology in the fabrication of semiconductor-critical
devices. This study presents a mathematical model to analyze the behavior of interface …
devices. This study presents a mathematical model to analyze the behavior of interface …
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
Wearout reliability and diffusion kinetics of Au and Pd‐coated Cu (PdCu) ball bonds are
useful technical information for Cu wire deployment in nanoscale semiconductor device …
useful technical information for Cu wire deployment in nanoscale semiconductor device …