The future of two-dimensional semiconductors beyond Moore's law

KS Kim, J Kwon, H Ryu, C Kim, H Kim, EK Lee… - Nature …, 2024 - nature.com
The primary challenge facing silicon-based electronics, crucial for modern technological
progress, is difficulty in dimensional scaling. This stems from a severe deterioration of …

Transistor engineering based on 2D materials in the post-silicon era

S Zeng, C Liu, P Zhou - Nature Reviews Electrical Engineering, 2024 - nature.com
The miniaturization of metal–oxide–semiconductor field-effect transistors (MOSFETs) has
been the driving force behind the development of integrated circuits over the past 60 years; …

Fundamental aspects of steady-state conversion of heat to work at the nanoscale

G Benenti, G Casati, K Saito, RS Whitney - Physics Reports, 2017 - Elsevier
In recent years, the study of heat to work conversion has been re-invigorated by
nanotechnology. Steady-state devices do this conversion without any macroscopic moving …

[HTML][HTML] Emerging challenges and materials for thermal management of electronics

AL Moore, L Shi - Materials today, 2014 - Elsevier
The rapid development of faster, cheaper, and more powerful computing has led to some of
the most important technological and societal advances in modern history. However, the …

[HTML][HTML] Nanoscale thermal transport. II. 2003–2012

DG Cahill, PV Braun, G Chen, DR Clarke… - Applied physics …, 2014 - pubs.aip.org
A diverse spectrum of technology drivers such as improved thermal barriers, higher
efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic …

Tailoring highly ordered graphene framework in epoxy for high-performance polymer-based heat dissipation plates

J Ying, X Tan, L Lv, X Wang, J Gao, Q Yan, H Ma… - ACS …, 2021 - ACS Publications
As the power density and integration level of electronic devices increase, there are growing
demands to improve the thermal conductivity of polymers for addressing the thermal …

Defect scattering can lead to enhanced phonon transport at nanoscale

Y Hu, J Xu, X Ruan, H Bao - Nature Communications, 2024 - nature.com
Defect scattering is well known to suppress thermal transport. In this study, however, we
perform both molecular dynamics and Boltzmann transport equation calculations, to …

A review on advanced carbon-based thermal interface materials for electronic devices

J Khan, SA Momin, M Mariatti - Carbon, 2020 - Elsevier
Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

Inelastic phonon transport across atomically sharp metal/semiconductor interfaces

Q Li, F Liu, S Hu, H Song, S Yang, H Jiang… - Nature …, 2022 - nature.com
Understanding thermal transport across metal/semiconductor interfaces is crucial for the
heat dissipation of electronics. The dominant heat carriers in non-metals, phonons, are …

Opportunities at the frontiers of spintronics

A Hoffmann, SD Bader - Physical Review Applied, 2015 - APS
The field of spintronics, or magnetic electronics, is maturing and giving rise to new subfields.
These new directions involve the study of collective spin excitations and couplings of the …