A 58–65 GHz neutralized CMOS power amplifier with PAE above 10% at 1-V supply
WL Chan, JR Long - IEEE journal of solid-state circuits, 2010 - ieeexplore.ieee.org
A 60-GHz band, three-stage pseudo-differential power amplifier (PA) is implemented with
input and output baluns on-chip. Each stage consists of a neutralized common-source …
input and output baluns on-chip. Each stage consists of a neutralized common-source …
Reliability characterization and modeling solution to predict aging of 40-nm MOSFET DC and RF performances induced by RF stresses
L Negre, D Roy, F Cacho, P Scheer… - IEEE Journal of Solid …, 2012 - ieeexplore.ieee.org
In the framework of MOSFET reliability for RF/AMS applications, a deep investigation of RF
parameters degradation is performed. An innovative flow, composed of DC and RF stresses …
parameters degradation is performed. An innovative flow, composed of DC and RF stresses …
Degradation mechanisms in CMOS power amplifiers subject to radio-frequency stress and comparison to the DC case
An in-depth study of the degradation dynamics in CMOS power amplifiers is presented. The
transistor was operated at 1.9 GHz under real-world load and power conditions. Threshold …
transistor was operated at 1.9 GHz under real-world load and power conditions. Threshold …
A+ 32 dBm 1.85 GHz class-D outphasing RF PA in 130nm CMOS for WCDMA/LTE
This paper presents a Class-D outphasing RF Power Amplifier (PA) which can operate at a
5.5 V supply and deliver+ 32dBm at 1.85 GHz in a standard 130nm CMOS technology. The …
5.5 V supply and deliver+ 32dBm at 1.85 GHz in a standard 130nm CMOS technology. The …
Oxide breakdown after RF stress: Experimental analysis and effects on power amplifier operation
L Larcher, D Sanzogni, R Brama… - 2006 IEEE …, 2006 - ieeexplore.ieee.org
The target in the design of CMOS radio-frequency (RF) transceivers for wireless application
is the highest integration level, despite reliability issues of conventional submicron …
is the highest integration level, despite reliability issues of conventional submicron …
Electrical and temperature stress effects on class-AB power amplifier performances
C Yu, JS Yuan - IEEE transactions on electron devices, 2007 - ieeexplore.ieee.org
Normalized degradations of drain efficiency and output power as a function of conduction
angle, maximum drain current, and maximum output voltage are modeled. Good agreement …
angle, maximum drain current, and maximum output voltage are modeled. Good agreement …
RF reliability of short channel NMOS devices
D Stephens, T Vanhoucke… - 2009 IEEE Radio …, 2009 - ieeexplore.ieee.org
The complexities associated with performing accurate large-signal measurements have
been prohibitive in determining device level reliability under RF stress. In this work, a large …
been prohibitive in determining device level reliability under RF stress. In this work, a large …
DC and RF Degradation Induced by High RF Power Stresses in 0.18- nMOSFETs
CH Liu, RL Wang, YK Su, CH Tu… - IEEE Transactions on …, 2010 - ieeexplore.ieee.org
Both the degradations of dc and RF characteristics of nMOS transistors due to hot-carrier
effect and instantaneous high RF power stresses are presented in this paper. The drain …
effect and instantaneous high RF power stresses are presented in this paper. The drain …
Evaluation of hot-electron effect on LDMOS device and circuit performances
JS Yuan, L Jiang - IEEE transactions on electron devices, 2008 - ieeexplore.ieee.org
Laterally double-diffused MOS (LDMOS) transistors subjected to hot-electron stress effects
have been studied experimentally. The measured threshold voltage, on-resistance, and gate …
have been studied experimentally. The measured threshold voltage, on-resistance, and gate …
Evaluation of RF-stress effect on class-E MOS power-amplifier efficiency
JS Yuan, J Ma - IEEE transactions on electron devices, 2007 - ieeexplore.ieee.org
RF-stress effects on MOS power-amplifier performance are studied. The class-E power-
amplifier power efficiency as a function of breakdown (BD) location has been evaluated. The …
amplifier power efficiency as a function of breakdown (BD) location has been evaluated. The …