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An integrated wafer surface evolution model for chemical mechanical planarization (CMP)
Chemical mechanical planarization (CMP) is recognized as a promising planarization
method in integrated circuit (IC) manufacturing. A detailed description of the CMP process …
method in integrated circuit (IC) manufacturing. A detailed description of the CMP process …
An Integrated Wafer Surface Evolution Model for Chemical Mechanical Planarization (CMP).................................................................................... Micayla Haugen
Chemical mechanical planarization (CMP) is recognized as a promising planarization
method in integrated circuit (IC) manufacturing. A detailed description of the CMP process …
method in integrated circuit (IC) manufacturing. A detailed description of the CMP process …
[KÖNYV][B] Mechanics framework of pad scratching in chemical-mechanical planarization
DC Ponte - 2015 - search.proquest.com
Abstract Chemical-Mechanical Planarization (CMP) is a crucial intermediate process in
integrated circuit (IC) fabrication. As the average IC feature size decreases each year …
integrated circuit (IC) fabrication. As the average IC feature size decreases each year …