Review of printed-circuit-board level EMI/EMC issues and tools
B Archambeault, C Brench… - IEEE Transactions on …, 2010 - ieeexplore.ieee.org
A comprehensive review of printed circuit board (PCB) electromagnetic compatibility (EMC)
issues, analysis techniques, and possible solutions would fill a large book or more. This …
issues, analysis techniques, and possible solutions would fill a large book or more. This …
Overview of power integrity solutions on package and PCB: Decoupling and EBG isolation
TL Wu, HH Chuang, TK Wang - IEEE Transactions on …, 2010 - ieeexplore.ieee.org
Mitigating power distribution network (PDN) noise is one of the main efforts for power
integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are …
integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are …
Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs
In this article, we first propose a deep reinforcement learning (RL)-based optimal decoupling
capacitor (decap) design method for silicon interposer-based 2.5-D/3-D integrated circuits …
capacitor (decap) design method for silicon interposer-based 2.5-D/3-D integrated circuits …
[BUCH][B] Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
XC Wei - 2017 - taylorfrancis.com
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …
Boards and Packaging presents the electromagnetic modelling and design of three major …
PCB EMC design guidelines: a brief annotated list
T Hubing - 2003 IEEE Symposium on Electromagnetic …, 2003 - ieeexplore.ieee.org
Some of the worst printed circuit board design choices are made by engineers who are
trying to comply with a list of EMC design guidelines. Nevertheless, a short list of design …
trying to comply with a list of EMC design guidelines. Nevertheless, a short list of design …
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
C Wang, J Mao, G Selli, S Luan, L Zhang… - IEEE Transactions …, 2006 - ieeexplore.ieee.org
Investigation of a dc power delivery network, consisting of a multilayer PCB using area fills
for power and return, involves the distributed behavior of the power/ground planes and the …
for power and return, involves the distributed behavior of the power/ground planes and the …
Multipin optimization method for placement of decoupling capacitors using a genetic algorithm
I Erdin, R Achar - IEEE Transactions on Electromagnetic …, 2018 - ieeexplore.ieee.org
A genetic algorithm (GA)-based method is proposed for simultaneous optimization of
decoupling capacitors assigned to multiple pins of a ball-grid array (BGA) package on a …
decoupling capacitors assigned to multiple pins of a ball-grid array (BGA) package on a …
Jitter-aware economic pdn optimization with a genetic algorithm
This article proposes a jitter-aware decoupling capacitors placement optimization method
that uses the genetic algorithm (GA). A novel method for defining the optimization target …
that uses the genetic algorithm (GA). A novel method for defining the optimization target …
Decoupling capacitor placement in power delivery networks using MFEM
The impedance of the power distribution network (PDN) needs to be minimized in order to
prevent unwanted voltage fluctuations at frequencies where current transients occur. To …
prevent unwanted voltage fluctuations at frequencies where current transients occur. To …
Parameter optimization of laser drilling for through-glass vias based on deep learning and Bayesian algorithm
Y Ouyang, D Hou, T Lv, F Dong, S Liu… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
In the semiconductor industry, especially in the manufacturing of through-glass vias (TGVs),
there is an increasing need to improve the quality and efficiency of manufacturing …
there is an increasing need to improve the quality and efficiency of manufacturing …