Degradation of hexagonal silicon-carbide-based bipolar devices

M Skowronski, S Ha - Journal of applied physics, 2006‏ - pubs.aip.org
Only a few years ago, an account of degradation of silicon carbide high-voltage pin diodes
was presented at the European Conference on Silicon Carbide and Related Compounds …

Stacking faults in 4H–SiC epilayers and IGBTs

P Wang, W Cheng, Y Li, L Xu, P Hou, L Yu, Y Li… - Materials Science in …, 2024‏ - Elsevier
Silicon carbide (SiC) power devices are heading towards high power and high voltage,
where 4H–SiC bipolar devices play a key role due to low on-resistance and ultra-high …

Modeling of stacking faults in 4h-sic n-type epilayer for tcad simulation

S Asada, K Murata, H Tsuchida - IEEE Transactions on Electron …, 2023‏ - ieeexplore.ieee.org
Current–voltage characteristics of an n-type 4H-silicon carbide (SiC) epilayer containing a
stacking fault (SF) were analyzed using a technology computer-aided design (TCAD) …

Modeling of bipolar degradations in 4H-SiC power MOSFET devices by a 3C-SiC inclusive layer consideration in the drift region

A Lachichi, P Mawby - IEEE Transactions on Power Electronics, 2021‏ - ieeexplore.ieee.org
The reliability of 4H-SiC power devices accounts not only to power packages but as well to
SiC materials which contain defects that impact the performance of power converters. A …

Morphology of basal plane dislocations in 4H-SiC homoepitaxial layers grown by chemical vapor deposition

X Zhang, S Ha, Y Hanlumnyang, CH Chou… - Journal of Applied …, 2007‏ - pubs.aip.org
The morphology of basal plane dislocations (BPDs) in 4 H-Si C homoepitaxial layers has
been investigated by plan-view transmission x-ray topography and molten KOH etching …

Limited current conduction due to various types of stacking faults in n-type 4H-SiC epilayers

S Asada, K Murata, H Tsuchida - Applied Physics Express, 2022‏ - iopscience.iop.org
Impacts of various types of stacking faults (SFs) on electron conduction in an n-type 4H-SiC
epilayer were experimentally investigated. N-type Schottky barrier diodes were fabricated …

[HTML][HTML] Impacts of silicon carbide defects on electrical characteristics of SiC devices

L Lai, Y Cui, Y Zhong, KY Cheong, H Linewih… - Journal of Applied …, 2025‏ - pubs.aip.org
With more than thirty years of research and development until commercialization,
performance, reliability, and robustness of silicon carbide (SiC) based devices have been …

[HTML][HTML] Impacts of single Shockley-type stacking faults on current conduction in 4H-SiC PiN diodes

S Asada, K Murata, H Tsuchida - Journal of Applied Physics, 2024‏ - pubs.aip.org
The impacts of single Shockley-type stacking faults (1SSFs) on the electrical characteristics
of 4H-SiC PiN diodes were examined by fabricating the PiN diodes containing the 1SSF …

Thermal annealing and propagation of shockley stacking faults in 4H-SiC PiN diodes

JD Caldwell, KX Liu, MJ Tadjer, OJ Glembocki… - Journal of electronic …, 2007‏ - Springer
Stacking faults within 4H-SiC PiN diodes are known to be detrimental to device operation.
Here, we present electroluminescence (EL) images of 4H-SiC PiN diodes providing …

Electronic structure of 3C inclusions in 4H SiC

MS Miao, WRL Lambrecht - Journal of applied physics, 2007‏ - pubs.aip.org
The band gap, the polarization, and the quantum well states for 3C inclusions in 4H SiC are
studied in a systematic way with inclusions of 2–10 cubic layers in a supercell of 12 layers of …