Introducing a novel heat sink comprising PCM and air-Adapted to electronic device thermal management
R Kalbasi - International Journal of Heat and Mass Transfer, 2021 - Elsevier
With the introduction of PCM-based heat sinks, the cooling of the electronic components in
transient applications has been developed. The PCM-based heat sink effectiveness is …
transient applications has been developed. The PCM-based heat sink effectiveness is …
Flow pattern maldistribution and manipulation during two-phase cooling for power batteries: A critical review
Y Fang, H Yang, Y Huang, L Fan - Renewable and Sustainable Energy …, 2025 - Elsevier
As the one of key components for electric vehicle and renewable energy systems, power
battery is always confronted with the issue of thermal safety. It is therefore necessary to …
battery is always confronted with the issue of thermal safety. It is therefore necessary to …
[HTML][HTML] A review of experimental studies on flow boiling instabilities mitigation through geometrical modifications
J Camarasa, A Crespo, M Vilarrubí, M Ibáñez… - International Journal of …, 2024 - Elsevier
Flow boiling technology is considered one of the most promising cooling solutions for high
power microelectronics. However, flow boiling instabilities cause serious reliability problems …
power microelectronics. However, flow boiling instabilities cause serious reliability problems …
Study on the flow and heat transfer characteristics of pin-fin manifold microchannel heat sink
In order to improve the heat transfer performance of the manifold microchannel, a cylindrical
pin-fin manifold microchannel heat sink is designed on the basis of the manifold …
pin-fin manifold microchannel heat sink is designed on the basis of the manifold …
Numerical study on heat transfer characteristics of a pin–fin staggered manifold microchannel heat sink
Manifold microchannel (MMC) heat sink is an efficient thermal management solution for high
heat flux electronic devices. A pin–fin staggered manifold microchannel (PFSMMC) heat …
heat flux electronic devices. A pin–fin staggered manifold microchannel (PFSMMC) heat …
Thermal performance enhancement of phase change material heat sinks for thermal management of electronic devices under constant and intermittent power loads
Metal fin enhanced phase change material (PCM) has been successfully demonstrated as
an effective approach for electronic devices cooling, especially in the case of high-power …
an effective approach for electronic devices cooling, especially in the case of high-power …
[HTML][HTML] Hydrothermal performance of a heat sink using plate-fins: experimental and numerical investigations
The development of electronic devices is accompanied by the generation of significant heat.
A novel plate-fins design with various orientation angles of 30°, 35°, 37.5°, 40° and 45° was …
A novel plate-fins design with various orientation angles of 30°, 35°, 37.5°, 40° and 45° was …
Ultra-stable counter flow diverging minichannel heat sink with integrated microstructures for superior cooling performance
Efficient thermal management of miniaturized electronic devices is quite challenging
nowadays. It requires dissipation of very high heat flux without considerable elevation of …
nowadays. It requires dissipation of very high heat flux without considerable elevation of …
Highly stable subcooled flow boiling enabled by an opposed wall jet design
K Zhang, J Yang, X Huai, K Cheng - International Journal of Heat and Mass …, 2023 - Elsevier
Although flow boiling is well recognized as an effective method for cooling high-power
density electronic devices, the instability of flow boiling is still a great challenge owing to the …
density electronic devices, the instability of flow boiling is still a great challenge owing to the …
Flow boiling heat transfer enhancement using tuned geometrical contact-line pinning
C Salmean, H Qiu - ACS Applied Materials & Interfaces, 2023 - ACS Publications
Wettability patterning is a promising method to manipulate bubble dynamics in microscale
boiling systems, allowing the transfer of large heat fluxes at low wall temperatures. Herein …
boiling systems, allowing the transfer of large heat fluxes at low wall temperatures. Herein …