Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging
applications including die fitting, solderless interconnections, component renovation, display …

Crystalline silicon (c-Si) heterojunction (HJT) solar cells are one of the promising
technologies for next-generation industrial high-efficiency silicon solar cells, and many …

Enormous efforts have been made towards the next generation of flexible, low-cost,
environmentally benign printed electronics. In this regard, advanced materials for the printed …

A resin-free paste containing 1.5 μm Cu@ Ag particles was fabricated and used to form a
film with excellent electrical conductivity even after a significantly high-speed sintering …

We show the fast preparation of printable highly conductive polymer nanocomposites for
future low-cost electronics. Highly conductive polymer nanocomposites, consisting of an …

Fractal metallic dendrites have been drawing more attentions recently, yet they have rarely
been explored in electronic printing or packaging applications because of the great …

Electrical and mechanical integration approaches are essential for emerging hybrid
electronics that must robustly bond rigid electrical components with flexible circuits and …

In the present course of study, mirror-bright silver (Ag) coatings are electrodeposited via
pulse galvanostatic route from a cyanide-free thiosulphate-based bath containing …

The high cost of metallization using low-temperature cured Ag paste is one of the factors
limiting the industrial deployment of silicon heterojunction (SHJ) solar cells, which can be …

Due to the increased power density of electronic devices, the heat originated from the core
components increases the working temperature of the devices, enormously degrading their …