Tin sulfide (SnS) thin films were deposited with a single SnS target by radio frequency
magnetron sputtering while varying the working pressure (0.6 Pa to 2.6 Pa), and the …

Abstract B 4 C coatings for 10 B-based neutron detector applications were deposited using
high-power impulse magnetron sputtering (HiPIMS) and direct current magnetron sputtering …

The trend for heterogeneous integration has driven the need for a low-temperature bonding
process. Cu-Sn-In based solid-liquid interdiffusion (SLID) bonding technology has been …

We present here, for the first time, a fabrication technique that allows manufacturing scallop
free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs …

This study reviews soft errors in modern electronic assemblies, through silicon via (TSV),
and low α-solder bum** techniques for 3-D microelectronic packaging. The TSV …

Synthetic fused quartz is an ideal material for devices in millimeter wave (mm-wave) band,
particularly suited for devices and infrastructure in the 5G arena due to its excellent low loss …

This paper describes the microfabrication and electrical characterization of aluminum-
coated superconducting through-silicon vias (TSVs) with sharp superconducting transition …

In this article, shielded and airgap-isolated through-silicon vias (TSVs) are fabricated and
measured up to 50 GHz. The unique TSV configuration is low-loss and electrically shielded …

We designed and fabricated superconducting monolithic microwave integrated circuits
(MMICs) at 2 mm wavelengths. Balanced superconductor-insulator-superconductor (SIS) …

In this work, micropillar array structures with overhang roofs which increase the switching
range of the TiO2 photoresponsive wettability, have been fabricated. The liquid droplet …