BACKGROUND The semiconductor industry has experienced rapid growth due to
continuous improvements in the integration density of various electronic components (eg …

Filed: Jul. 30, 2014 A method of generating a techfile corresponding to a pre (65) Prior
Publication Data determined fabrication process is disclosed. The method includes …

Enhancements in lithography for forming an integrated circuit are disclosed. The
enhancements include a topography analysis of a design data file to obtain accumulative …

Described herein are technologies to facilitate device fabri cation, especially those that
involve spin-on coatings of a substrate (eg, wafer). More particularly, technologies described …

(57) ABSTRACT A design or lithographic enhancement process, a method for forming a
device based on the lithographic enhancement process and a system for pattern …

In accordance with an aspect, the present invention pro vides an integrated circuit design
and fabrication method. The integrated circuit design and fabrication method includes the …

A layout system is described comprising a layout unit configured to layout cells in a mask
design for a semiconductor chip based on library cells for a specified process node; a non …

A method for modeling planarization performance of a given material includes patterning a
first photoresist layer over a first material deposited over a substrate. The method also …

Process Scaling and rising device density increase power density and thermal effects for
integrated circuits. Increased power consumption and temperature may affect integrated …

G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original
having an opaque pattern on a transparent support, eg film printing, projection printing; by …