Light emitting diodes reliability review

MH Chang, D Das, PV Varde, M Pecht - Microelectronics Reliability, 2012 - Elsevier
The increasing demand for light emitting diodes (LEDs) has been driven by a number of
application categories, including display backlighting, communications, medical services …

[HTML][HTML] A critical review on the junction temperature measurement of light emitting diodes

C Cengiz, M Azarifar, M Arik - Micromachines, 2022 - mdpi.com
In the new age of illumination, light emitting diodes (LEDs) have been proven to be the most
efficient alternative to conventional light sources. Yet, in comparison to other lighting …

Increasing the reliability of solid state lighting systems via self-healing approaches: A review

U Lafont, H Van Zeijl, S Van Der Zwaag - Microelectronics Reliability, 2012 - Elsevier
Reliability issues in solid state lighting (SSL) devices based on light emitting diodes (LED) is
of major concern as it is a limiting factor to promote these optoelectronic devices for general …

LED junction temperature measurement: from steady state to transient state

X Zhao, H Gong, L Zhu, Z Zheng, Y Lu - Sensors, 2024 - mdpi.com
In this review, we meticulously analyze and consolidate various techniques used for
measuring the junction temperature of light-emitting diodes (LEDs) by examining recent …

Failure mechanisms and reliability issues in LEDs

MG Pecht, MH Chang - Solid State Lighting Reliability: Components to …, 2012 - Springer
The construction of LEDs is somewhat similar to microelectronics, but there are unique
functional requirements, materials, and interfaces in LEDs that make their failure modes and …

[HTML][HTML] Optimization of a cylindrical heatsink with L-shaped fins to minimize thermal resistance variation by installation angle

G Song, HH Nam, S Heo, SJ Yook - Case Studies in Thermal Engineering, 2025 - Elsevier
Abstract Light Emitting Diode (LED) lighting can be installed at various angles depending on
user preferences. However, the cooling performance of heatsinks may decrease with …

High power InGaN/GaN flip‐chip LEDs with via‐hole‐based two‐level metallization electrodes

J Lv, C Zheng, Q Chen, S Zhou, S Liu - physica status solidi (a), 2016 - Wiley Online Library
High power flip‐chip light‐emitting diodes with distributed n‐type via‐hole‐based two‐level
metallization electrodes (TLM‐FCLED) were fabricated and investigated. Comparison tests …

Fabrication of Ag-MWNT nanocomposite paste for high-power LED package

KS Kim, BG Park, H Kim, HS Lee, SB Jung - Current Applied Physics, 2015 - Elsevier
A silver-multi-walled carbon nanotube (Ag-MWNT) nanocomposite was utilized as a thermal
interface material for a high-power light-emitting diode (LED) package. The nanocomposite …

[BOEK][B] III-Nitride LEDs: From UV to Green

S Zhou, S Liu - 2022 - books.google.com
This book highlights state-of-the-art in III-nitrides-based light-emitting diodes (LEDs).
Motivated by the application prospects in lighting, high-resolution display, and health & …

Application of accelerated life testing principles to project long term lumen maintenance of LED luminaires

KR Shailesh, CP Kurian, SG Kini… - … on Emerging Trends …, 2012 - ieeexplore.ieee.org
This work presents our effort to predict the long term reliability of LED arrays using the
application of accelerated life testing principles. Assessment of long term reliability and …