Dopant, composition and carrier profiling for 3D structures
W Vandervorst, C Fleischmann, J Bogdanowicz… - Materials Science in …, 2017 - Elsevier
With the transition from planar to three-dimensional device architectures, devices such as
FinFETs, TFETs and nanowires etc. become omnipresent. This requires the dopant atom …
FinFETs, TFETs and nanowires etc. become omnipresent. This requires the dopant atom …
Nanoindentation induced deformation and pop-in events in a silicon crystal: molecular dynamics simulation and experiment
S Jiapeng, L Cheng, J Han, A Ma, L Fang - Scientific reports, 2017 - nature.com
Silicon has such versatile characteristics that the mechanical behavior and deformation
mechanism under contact load are still unclear and hence are interesting and challenging …
mechanism under contact load are still unclear and hence are interesting and challenging …
[KSIĄŻKA][B] Metrology and Diagnostic Techniques for Nanoelectronics
Z Ma, DG Seiler - 2017 - taylorfrancis.com
Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …
Nonuniform Ionic and Electronic Transport of Ceramic and Polymer/Ceramic Hybrid Electrolyte by Nanometer‐Scale Operando Imaging for Solid‐State Battery
Replacing the liquid electrolyte in lithium batteries with solid‐state ion conductor is
promising for next‐generation energy storage that is safe and has high energy density …
promising for next‐generation energy storage that is safe and has high energy density …
Thin-film TaAs: Develo** a platform for Weyl semimetal devices
MX monopnictide compounds (M= Nb, Ta, X= As, P) are prototypical 3D Weyl semimetals
(WSMs) that have been shown in bulk single crystal form to have potential for a wide variety …
(WSMs) that have been shown in bulk single crystal form to have potential for a wide variety …
Application of atomic force microscopy technology in do** characterization of semiconductor materials and devices
X Liu, X Wang, X Liu, Y Song, Y Zhang, H Wang… - Microelectronic …, 2024 - Elsevier
The precise characterization of the do** profile is crucial for optimizing the performance
and structural integrity of semiconductor devices. As the size of semiconductor devices …
and structural integrity of semiconductor devices. As the size of semiconductor devices …
In situ observation of the indentation-induced phase transformation of silicon thin films
Indentation-induced phase transformation processes were studied by in situ Raman
microspectroscopy of the deformed contact region of silicon on sapphire samples during …
microspectroscopy of the deformed contact region of silicon on sapphire samples during …
Shear-induced chemical segregation in a Fe-based bulk metallic glass at room temperature
DV Louzguine-Luzgin, AS Trifonov, YP Ivanov… - Scientific Reports, 2021 - nature.com
Shear-induced segregation, by particle size, is known in the flow of colloids and granular
media, but is unexpected at the atomic level in the deformation of solid materials, especially …
media, but is unexpected at the atomic level in the deformation of solid materials, especially …
Microelectronic Structure and Do** Nonuniformity of Phosphorus-Doped CdSeTe Solar Cells
CS Jiang, R Farshchi, T Nagle, D Lu… - … Applied Materials & …, 2025 - ACS Publications
Optimizing group-V do** and Se alloying are two main focuses for advancing CdTe
photovoltaic technology. We report on nanometer-scale characterizations of microelectronic …
photovoltaic technology. We report on nanometer-scale characterizations of microelectronic …
Influence of normal load on the three-body abrasion behaviour of monocrystalline silicon with ellipsoidal particle
Currently, monocrystalline silicon has been widely applied in micro-electro-mechanical
systems (MEMSs). It is of importance to reveal the wear behavior of the MEMS and evaluate …
systems (MEMSs). It is of importance to reveal the wear behavior of the MEMS and evaluate …