We review five solder joint reactions in 3D IC packaging technology which are of wide
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …

The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

Many investigations for develo** total hip arthroplasty performance presented in previous
literature show focusing on implant users' external factors. Although this is important …

The reliability of MEMS in shock environments is a complex area which involves structural
dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of …

In the past years, the finite element analysis (FEA) has proven to be a suitable way for
fatigue prediction of electronic equipment based on the physics-of-failure-approach. For this …

One of the primary failure modes for solder joints is caused by temperature cycling of the
component. The induced stress causes cree** which leads to crack initiation and …

Fiber-reinforced polymer composite (FRP) laminates have found increasing use in
advanced industrial applications. However, the limited knowledge and validated material …

Testing and validation of automotive components represents a major cost driver in the
development of electrical devices. Virtual release and integration of simulation into the …

This paper reviewed the existing damage evolution models in the literature for solder layer
in microelectronics and then proposed a two dimensional approximate time dependent …

A fast and accurate method based on experimentally obtainable parameters for the solder
joint reliability prediction under thermo-mechanical load can add significant value in the …