Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from
electrochemical migration (ECM) which significantly compromises the reliability of …

In order to get more information about the process of electrochemical migration (ECM), a
novel in situ optical inspection system was developed and tested. The optical inspection …

High performance electronics require printed circuit boards (PCBs) with an extremely narrow
pitch between adjacent copper patterns. However, copper electrochemical migration in …

In this paper, we describe an automated microfluidic flow loop analyzer toward an in-situ
phosphate measurement in natural waters. The system consists of a microfluidic chip and a …

Although failure reporting, analysis, and corrective action system (FRACAS) has two
management perspectives, its tasks and related information, the previous researches and …

The present paper gives an overview of surface failures, internal nonconformities and
solders joint failures detected by microscopic analysis of electronic assemblies. Optical …

In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were
investigated. There different alloys were studied: two micro-alloyed SAC (SnAgCu+ Bi+ Sb) …

This paper presents the relation between the tin whiskering ability of lead-free Sn/Ag/Cu
(SAC) solder alloys and the current load. For the investigation three solder alloy was …

A high resistance measuring system (HRMS) is used to measure the surface insulation
resistance (SIR) values of the printed circuit board (PCB), and monitor whether a momentary …

In this paper, a new method for calculating the amount of solder paste required for Pin-in-
paste technology is presented and compared to a widely used explicit expression from …