The idea of using through-silicon-via (TSV) technology has been around for many years.
However, this technology has only recently been introduced into high volume …

Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Vertically integrated circuits (3-D ICs) may revitalize Moore's law scaling which has slowed
down in recent years. 3-D stacking is an emerging technology that stacks multiple dies …

This paper summarizes the thermal challenges in conventional 3-D stacks and proposes a
novel stacking structure that eases the thermal problem. The objective of this paper is first to …

In this paper, we first present a comprehensive study of the unique thermal behavior in
monolithic 3-D integrated circuits (ICs) in contrast to through silicon via-based 3-D ICs. In …

In this paper, compact circuit models and HSPICE simulations are used to benchmark die-to-
die communication channels in 2.5-D and 3-D heterogeneous integration platforms. The …

With no further shrinking of device size, 3-D chip stacking by through-silicon-via (TSV) has
been identified as an effective way to achieve better performance in speed and power …

On the integration of 3D IC design, thermal management issues play a significant role. So, it
is required to implement an effective approaches and solutions for integrating 3DIC. The …

Monolithic 3D (M3D) is an emerging heterogeneous integration technology that overcomes
the limitations of the conventional through-silicon-via (TSV) and provides significant …