Heat dissipation remains a key challenge to be addressed, determining the performance
and durability of smart electronic devices. Graphene reinforced metal matrix composites …

Although the individual one-and two-dimensional (1D and 2D) carbon nanostructures
possess extremely high thermal conductivity, their macroscopic assemblies do not efficiently …

The emerging applications of composite gels as thermal interface materials (TIMs) for chip
heat dissipation in intelligent vehicle and wearable devices require high thermal conductivity …

Interfacial thermal resistance plays a critical role in heat dissipation, when the mean free
paths of heat energy carriers approach or exceed the characteristic lengths of devices. Deep …

Accurate measurements and physical understanding of thermal boundary resistance (R) of
two-dimensional (2D) materials are imperative for effective thermal management of 2D …

Thermal conductivity is a crucial material property for a diverse range of energy
technologies, ranging from thermal management of high power electronics to thermal …

The continuing miniaturization and increasing power density of two-dimensional (2D)
material electronic devices pose a great challenge for effective thermal management, which …

Abstract Graphene/GaN and MoS2/GaN have important applications in optoelectronic
devices. The two-dimensional (2D) materials greatly improves the device performance due …

With the rapid development of modern intelligent industry and the Internet of Things, the
demand for multifunctional electromagnetic interference (EMI) shielding material has …

Accurate measurement and deep understanding of interfacial thermal transport through
interfaces where two-dimensional (2D) materials are involved are crucial for efficient thermal …