A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints
This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …
[HTML][HTML] A comprehensive review of radiation effects on solder alloys and solder joints
In the realm of military and defence applications, exposure to radiation significantly
challenges the performance and reliability of solder alloys and joints in electronic systems …
challenges the performance and reliability of solder alloys and joints in electronic systems …
Cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages
An accelerated reliability testing via thermal cycling test (TCT) was used to test ball grid
array (BGA) components' reliability. Five variables were observed; control sample J and …
array (BGA) components' reliability. Five variables were observed; control sample J and …
Effect of indentation depth and strain rate on mechanical properties of Sn0. 3Ag0. 7Cu
X Niu, G Dong, X Li, X Geng, J Zhou - Microelectronics Reliability, 2022 - Elsevier
In this paper, nanoindentation tests with continuous stiffness measurement (CSM) technique
were conducted on Sn0. 3Ag0. 7Cu (SAC0307) at room temperature. The mechanical …
were conducted on Sn0. 3Ag0. 7Cu (SAC0307) at room temperature. The mechanical …
Significance of intermetallic compound (IMC) layer to the reliability of a solder joint, methods of IMC layer thickness measurements
Intermetallic compound (IMC) growth is being analyzed due to its significant effect on solder
joint reliability. It appears that from various works conducted whereby the excessive growth …
joint reliability. It appears that from various works conducted whereby the excessive growth …
Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
This study investigated the effectiveness of heat shield placement locations during the
rework process to avoid thermal and mechanical damage to adjacent ball grid array …
rework process to avoid thermal and mechanical damage to adjacent ball grid array …
Linear growth behaviour of intermetallic compound layer in electronic interconnections
We observed a linear behaviour of intermetallic compound (IMC) layer growth in electronic
metallurgical interconnections, although the time required was twice that of commercial …
metallurgical interconnections, although the time required was twice that of commercial …
Effect of alloy particle size and stencil aperture shape on solder printing quality
Purpose Reflow solder joint quality is significantly affected by the ability of the solder to
perfectly fill pad space and retain good solder joint shape. This study aims to investigate …
perfectly fill pad space and retain good solder joint shape. This study aims to investigate …
Thermal cycling effect on the crack formation of solder joint in ball grid array package
Ball grid array (BGA) technology is one of the technologies used in surface mount
technology (SMT). It provides many interconnection points via the solder ball and thus give …
technology (SMT). It provides many interconnection points via the solder ball and thus give …
Effect of moisture content on crack formation during reflow soldering of ball grid array (BGA) component
Semiconductor packaging assembly process involves many variables such as temperature,
pressure, humidity, chemical interaction together with various type of materials. Such …
pressure, humidity, chemical interaction together with various type of materials. Such …