Recent advances in semiconductor technology offer vertical interconnect access (via) that
extend through silicon, popularly known as through silicon via (TSV). This book provides a …

Aggressive scaling of semiconductor process technology over the last several decades has
resulted in creation of many new products, such as computers, camera, cell phones, and …

Mixed carbon nanotube bundles (MCBs) are considered to be highly potential interconnect
solutions in the current nanoscale regime. Different MCBs with random and spatial …

An integrated circuit (IC), or chip, is a set of electronic circuits and components placed on a
tiny planar silicon (Si) semiconductor substrate. These electronics circuits and components …

Reductions in feature size and function integration require either replacement or
modification of existing interconnect materials to fit ever advancing technology. Due to their …

Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive
solution in nanoscale VLSI interconnects. In current fabrication process, it is not trivial to …

Having a 1D material like Multiwall Carbon Nanotube (MWCNT) as a potential candidate for
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …

The temperature-dependent circuit modeling and performance analysis in terms of crosstalk
in capacitively coupled mixed carbon nanotube bundle (MCB) interconnects, at the far end …

Carbon nanotubes (CNTs), including single-walled carbon nanotubes (SWNTs) and multi-
walled carbon nanotubes (MWNTs), are considered to be the promising candidates for next …

The aroused quest to reduce the delay at the interconnect level is the main urge of this
paper, so as to come across a configuration of carbon nanotube (CNT) bundles, namely …