Recent advances of photodetection technology based on main group III–V semiconductors

J Ai, M Qin, M Xue, C Cao, J Zhang… - Advanced Functional …, 2024 - Wiley Online Library
The rapid advancement of main group III–V nanomaterials endows photodetectors (PDs)
with enhanced performance. At present, various III–V nanomaterials are systematically …

A review of ultra-short pulse laser micromachining of wide bandgap semiconductor materials: SiC and GaN

K Jiang, P Zhang, S Song, T Sun, Y Chen, H Shi… - Materials Science in …, 2024 - Elsevier
Wide bandgap (WBG) materials have excellent semiconductor and physicochemical
properties and are emerging materials. Silicon carbide (SiC) and gallium nitride (GaN), two …

High-power, electrically-driven continuous-wave 1.55-μm Si-based multi-quantum well lasers with a wide operating temperature range grown on wafer-scale InP-on …

J Sun, J Lin, M Zhou, J Zhang, H Liu, T You… - Light: Science & …, 2024 - nature.com
A reliable, efficient and electrically-pumped Si-based laser is considered as the main
challenge to achieve the integration of all key building blocks with silicon photonics. Despite …

Recent advances in III-V nitrides: properties, applications and perspectives

S Li, G Li, M Zhu, Z Guo, Y Yang, H Li… - Journal of Materials …, 2024 - pubs.rsc.org
This paper reviews recent research on III–V nitrides, including their physical and chemical
properties, synthesis methods, and applications in optoelectronic devices. III–V nitrides …

[PDF][PDF] Applications of lasers: a promising route toward low-cost fabrication of high-efficiency full-color micro-LED displays

S Lai, S Liu, Z Li, Z Zhang, Z Chen, R Zhang… - Opto-Electronic …, 2023 - researching.cn
Micro-light-emitting diodes (micro-LEDs) with outstanding performance are promising
candidates for next-generation displays. To achieve the application of high-resolution …

Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing

Y Zhang, X **e, Y Huang, W Hu, J Long - Ceramics International, 2023 - Elsevier
Abstract Silicon Carbide (SiC) is an important substrate material for electronic components
due to its excellent properties. Compared with wire sawing technology, laser slicing …

Laser lift‐off technologies for ultra‐thin emerging electronics: mechanisms, applications, and progress

F Wang, Q Liu, J **a, M Huang, X Wang… - Advanced Materials …, 2023 - Wiley Online Library
Due to the advantages of non‐contact processing, high efficiency, high precision, and
superior controllability, laser lift‐off (LLO) technologies exhibit excellent material applicability …

Fabrication of GaN-Based Flexible VLEDs with Double-Side Light Emitting

S Yang, P Gu, T Yang, M Ma, L Ying, Y Mei… - ACS …, 2024 - ACS Publications
Flexible optoelectronic devices are promising in a broad range of applications, such as
virtual reality (VR), deformable displays, wearable optoelectronic devices, and consumer …

20 µm Micro‐LEDs Mass Transfer via Laser‐Induced In Situ Nanoparticles Resonance Enhancement

W Sun, L Ji, Z Lin, L Zhang, Z Wang, W Qin, T Yan - Small, 2024 - Wiley Online Library
Ultrafast laser is expected as a promising strategy for micro‐LEDs (µ‐LEDs) transfer due to
its inherent property of suppressing thermal effects. However, its ultrahigh peak power and …

Efficient access to non-damaging GaN (0001) by inductively coupled plasma etching and chemical–mechanical polishing

Q Li, S Wang, L Liu, K Song, J Yu, G Wang, J Liu… - Applied Surface …, 2025 - Elsevier
As third-generation semiconductors advance, gallium nitride (GaN)-based devices are
gaining significant attention. However, the processing of GaN substrates directly affects …