Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging
applications, including electromechanical, thermal, optical, biomedical, and RF devices, due …

Continuous demands to develop advanced radio-frequency transmission at higher
frequencies have initiated glass-based materials as a substrate in radio-frequency micro …

The present work analyzes the energy channelization behavior during the triplex hybrid
process of ultrasonic assisted electrochemical discharge machining (UA-ECDM). In this …

Compared with silicon-based inductors, the inductors with through glass via (TGV)
technology have significantly improved in quality () factor. On the basis of TGV technology, a …

Drilling micro holes on various engineering materials have been performed using
electrochemical discharge machining (ECDM), especially non-conductive material. A …

In recent semiconductor packaging, the adoption of through silicon via (TSV) technology has
become crucial for the integration of 2.5 and 3D Si chips, and interposers. The TSV offers …

With the advancement in the miniaturization of electronic components, the requirement for
the micromachining of electrically non-conductive substrates has become more important …

玻璃通孔(Through glass via, TGV) 三维互连技术由于具有优异的电学, 光学特性,
良好的力学稳定性和低成本等优势, 在三维封装, 集成无源器件和光电器件集成方面具有广泛 …

In recent semiconductor packaging, the adoption of through silicon via (TSV) technology has
become crucial for the integration of 2.5 and 3D Si chips, and interposers. The TSV offers …