With the increasing number of inputs and outputs, and the decreasing interconnection
spacing, electrical interconnection failures caused by electromigration (EM) have attracted …

Under alternating temperatures, the fatigue failure of solder balls caused by the mismatch of
the thermal expansion coefficient is a key problem in a Ball Grid Array (BGA). However, the …

As the integration of chips in 3D integrated circuits (ICs) increases and the size of micro-
bumps reduces, issues with the reliability of service due to electromigration and …

Solder layer voids have a significant impact on the thermal performance of a device, which is
a key cause of the thermal failure of the device. In this paper, the area and location of solder …

Accelerated testing has been executed to examine the combined influence of
electromigration (EM) stressors (elevated current density and elevated ambient temperature) …

With the rapid development of the advanced electronic packaging field, the requirements for
the connection between solder and Cu substrate are becoming increasingly stringent …

The results contained within this paper examine the combined influence of electromigration
stressors (elevated current density and elevated ambient temperature) and tensile stress on …