High-tech industry creates economy for Taiwan; nevertheless, it is wondered whether it also
results in environment crises. With the excellent geo-environment, fast growth of parks, and …

Probe testing is performed on all chips during the manufacturing process to ensure quality
control in semiconductor. To enhance productivity in semiconductor manufacturing, it is …

This research is for the design of a low speed coupling having a taper structure connecting
the main shaft and the gear box of a wind power turbine. The low speed coupling transmits …

This paper describes structural analysis method considering Joule-heating for a reliable
design of vertical probe. In this study, the tensile tests were performed to obtain mechanical …

As fine-pitch 3D wafer-level packaging becomes more popular in semiconductor industries,
wafer-level prebond testing of various interconnect structures has become increasingly …

In this study, a method which would improve reliability of coated vertical type micro-probe
under Joule heating is described. The method is to decouple the mechanical and electrical …

Wafer probing is a core inspection process to detect defects in a wafer prior to packaging.
Since probe card requires over a million touchdowns on wafers, service life of the probe …

With the development of technology, semiconductor components are now being used in
many parts of IT components and solar modules. Because of the features of these products …

Majority of deformation and ruptures as a result of severe deformation of mechanical
structures are due to the existence of cracks or cracks generated through specific situations …

17 1/2018 müssen dazu die auf dem Aluminium oder Kupfer stets vorhandene Oxid-bzw.
Kontaminationsschicht der zu prüfenden Pads durch leichtes Kratzen (Scrub) durchdringen …