Improved predictions of lead free solder joint reliability that include aging effects
It has been demonstrated that isothermal aging leads to large reductions (up to 50%) in
several key material properties for lead free solders including stiffness (modulus), yield …
several key material properties for lead free solders including stiffness (modulus), yield …
A critical review of constitutive models for solders in electronic packaging
G Chen, X Zhao, H Wu - Advances in Mechanical …, 2017 - journals.sagepub.com
Owing to their superior electrical, thermal, and mechanical properties, solder joints are the
most widely used interconnection materials in electronic product packaging. Because the …
most widely used interconnection materials in electronic product packaging. Because the …
Determination of Anand constants for SAC solders using stress-strain or creep data
The Anand viscoplastic constitutive model is often used to represent the deformation
behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are …
behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are …
Correlation of reliability models including aging effects with thermal cycling reliability data
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
Process-induced voids remain one of the key concerns in thermo-mechanical reliability of
solder alloys. Previous studies reported that the void effect on fatigue failure reliability of …
solder alloys. Previous studies reported that the void effect on fatigue failure reliability of …
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder
Lead free solder materials are widely used in electronic packaging industry due to
environmental concerns. However, experimental testing and microstructural characterization …
environmental concerns. However, experimental testing and microstructural characterization …
The Anand parameters for SAC solders after extreme aging
The mechanical behavior of lead free solder materials is often represented using the Anand
viscoplastic constitutive model. This nine parameter model is built into popular commercial …
viscoplastic constitutive model. This nine parameter model is built into popular commercial …
Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate
Y Zhou, L Xu, S Liu - Microelectronic Engineering, 2015 - Elsevier
Inevitable and severe warpage and stress due to serious mismatch in coefficient of thermal
expansion (CTE) between direct bond copper (DBC) plate and copper substrate will be …
expansion (CTE) between direct bond copper (DBC) plate and copper substrate will be …
Characterization of doped SAC solder materials and determination of Anand parameters
In the electronic packaging industry, it is important to be able to make accurate predictions of
board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic …
board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic …
Thermal induced interface mechanical response analysis of SMT lead-free solder joint and its adaptive optimization
S Liu, Y Yan, Y Zhou, B Han, B Wang, D Zhang, S Xue… - Micromachines, 2022 - mdpi.com
Surface mount technology (SMT) plays an important role in integrated circuits, but due to
thermal stress alternation caused by temperature cycling, it tends to have thermo …
thermal stress alternation caused by temperature cycling, it tends to have thermo …